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High Temperature Behavior of Polysilicon

Published online by Cambridge University Press:  11 February 2011

Chung-Seog Oh ,
George Coles  and
William N. Sharpe Jr
Chung-Seog Oh
Affiliation:
Department of Mechanical Engineering, Johns Hopkins University
George Coles
Affiliation:
Department of Mechanical Engineering, Johns Hopkins University
William N. Sharpe Jr
Affiliation:
Department of Mechanical Engineering, Johns Hopkins University
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Abstract

The polysilicon elements of thermal actuators can reach temperatures high enough to cause permanent deformation. A fundamental understanding of the constitutive behavior is necessary for intelligent design and life prediction, but mechanical testing at high temperatures is especially challenging at the micron level.

This paper describes techniques for testing freestanding thin-film polysilicon specimens in tension at temperatures up to 700°C. Strain is measured directly on the specimens by laser interferometry from platinum markers. The complete stress-strain curve can be obtained as well as strain versus time for creep tests. Initial results show that polysilicon is ductile at temperatures above 500°C and can have a high creep rate.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 741: Symposium J – Nano- and Microelectromechanical Systems (NEMS and MEMS) and Molecular Machines , 2002 , J3.6
Copyright
Copyright © Materials Research Society 2003

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References

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