Hostname: page-component-586b7cd67f-t8hqh Total loading time: 0 Render date: 2024-11-24T14:24:46.357Z Has data issue: false hasContentIssue false
  • English
  • Français

High Cooling Power Density of SiGe/Si Superlattice Microcoolers

Published online by Cambridge University Press:  21 March 2011

Gehong Zeng ,
Xiaofeng Fan ,
Chris LaBounty ,
John E. Bowers ,
Edward Croke ,
James Christofferson ,
Daryoosh Vashaee ,
Yan Zhang  and
Ali Shakouri
Gehong Zeng
Affiliation:
Department of Electrical and Computer Engineering, University of California, Santa Barbara, California 93106
Xiaofeng Fan
Affiliation:
Department of Electrical and Computer Engineering, University of California, Santa Barbara, California 93106
Chris LaBounty
Affiliation:
Department of Electrical and Computer Engineering, University of California, Santa Barbara, California 93106
John E. Bowers
Affiliation:
Department of Electrical and Computer Engineering, University of California, Santa Barbara, California 93106
Edward Croke
Affiliation:
HRL Laboratories, LLC, Malibu, California, 90265
James Christofferson
Affiliation:
Baskin School of Engineering, University of California, Santa Cruz, CA 95064
Daryoosh Vashaee
Affiliation:
Baskin School of Engineering, University of California, Santa Cruz, CA 95064
Yan Zhang
Affiliation:
Baskin School of Engineering, University of California, Santa Cruz, CA 95064
Ali Shakouri
Affiliation:
Baskin School of Engineering, University of California, Santa Cruz, CA 95064
Get access

Abstract

Fabrication and characterization of SiGe/Si superlattice microcoolers integrated with thin film resistors are described. Superlattice structures were used to enhance the device performance by reducing the thermal conductivity, and by providing selective emission of hot carriers through thermionic emission. Thin film metal resistors were integrated on top of the cooler devices and they were used as heat load for cooling power density measurement. Various device sizes were characterized. Net cooling over 4.1 K and a cooling power density of 598 W/cm2 for 40 × 40 μm2 devices were measured at room temperature.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 691: Symposium G – Thermoelectric Materials 2001--Research and Applications , 2001 , G6.6
Copyright
Copyright © Materials Research Society 2002

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1 Venkatasubramanian, R., Siivola, E., Colpitts, T., and O'Quinn, B., Nature 413, 597–602 (2001).Google Scholar
2 Goldsmit, H. J., Thermoelectric Refrigeration (Plenum, New York, 1964).Google Scholar
3 Vining, J. B., J. Appl. Phys. 69, 331–341 (1991).Google Scholar
4 Shakouri, A. and Bowers, J. E., in The 16th International Conference on Thermoelectrics, Dresden, Germany, 26-29 Aug. 1997, p. 636–40.Google Scholar
5 Shakonri, A., LaBounty, C., Abraham, P., Piprekt, J., Bowers, J. E., in The Next Generation Materials for Small-Scale Refrigeration and Power Generation Applications Symposium, Boston, MA, USA 30 Nov.-3 Dec. 1998, p. 449–58.Google Scholar
6 Shakouri, A. and Bowers, J. E., Applied Physics Letters 71, 1234–6 (1997).Google Scholar
7 Vining, C. B. and Mahan, G. D., Journal of Applied Physics 86, 6852–3 (1999).Google Scholar
8 Shakouri, A., LaBounty, C., Piprek, J., Abraham, P., and Bowers, J. E., Applied Physics Letters 74, 88–9 (1999).Google Scholar
9 Hicks, L. D., Harman, T. C., and Dresselhaus, M. S., Applied Physics Letters 63, 3230–2(1993).Google Scholar
10 Koga, T., Sun, X., Cronin, S. B., and Dresselhaus, M. S., Applied Physics Letters 73, 2950–2 (1998).Google Scholar
11 Koga, T., Sun, X., Cronin, S. B., and Dresselhaus, M. S., Applied Physics Letters 75, 2438–40 (1999).Google Scholar
12 Koga, T., Cronin, S. B., Dresselhaus, M. S., Liu, J. L., and Wang, K. L., Applied Physics Letters 77, 1490–2 (2000).Google Scholar
13 Xiaofeng, F., Gehong, Z., LaBounty, C., Bowers, J. E., Croke, E., Ahn, C. C., Huxtable, S., Majumdar, A., and Shakouri, A., Applied Physics Letters 78, 1580–2 (2001).Google Scholar
14 Xiaofeng, F., Gehong, Z., Croke, E., Robinson, G., LaBounty, C., Shakouri, A., Bowers, J. E., in The 7th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Las Vegas, NV, USA 23-26 May 2000, p. 304–7.Google Scholar
15 Gehong, Z., Shakouri, A., Bounty, C. L., Robinson, G., Croke, E., Abraham, P., Xiafeng, F., Reese, H., and Bowers, J. E., Electronics Letters 35, 2146–7 (1999).Google Scholar
16 Osten, H. J., Journal of Applied Physics 84, 2716–21 (1998).Google Scholar
17 Stein, B. L., Yu, E. T., Croke, E. T., Hunter, A. T., Laursen, T., Bair, A. E., Mayer, J. W., and Ahn, C. C., in The 24th Conference on the Physics and Chemistry of Semiconductor Interfaces Research, Triangle Park, NC, USA 12-15 Jan. 1997, p. 1108–11.Google Scholar
18 LaBounty, C., Shakouri, A., Robinson, G., Abraham, P., and Bowers, J. E., in The 18th International Conference on Thermoelectrics, Baltimore, MD, USA 29 Aug.-2 Sept. 1999, p. 23–6.Google Scholar
19 LaBounty, C., Shakouri, A., and Bowers, J. E., Journal of Applied Physics 89, 4059–64 (2001).Google Scholar
20 Coldren, L. and Corzine, S., Diode Lasers and Photonic Integrated Circuits (John Wiley & Sons, Inc., New York, 1995).Google Scholar
21 LaBounty, C., Ph. D. Thesis, University of California, Santa Barbara, 2001.Google Scholar