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Gas Flow Engineering in Rapid Thermal Processing

Published online by Cambridge University Press:  22 February 2011

Z. Nényei ,
H. Sommer ,
J. Gelpey  and
A. Bauer
Z. Nényei
Affiliation:
A.S.T. elektronik GmbH, Ulm, Germany
H. Sommer
Affiliation:
A.S.T. elektronik GmbH, Ulm, Germany
J. Gelpey
Affiliation:
A.S.T. elektronik U.S., FhG, Erlangen, Germany
A. Bauer
Affiliation:
A.S.T. elektronik U.S., FhG, Erlangen, Germany
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Abstract

Gas flow engineering involves gas dynamics optimization for effective ambient change before heating and for homogeneous convective cooling of the wafers during the heating steps. Multiple gas buffle system, dynamical gas handling, low pressure operation, low temperature edge guard ring and independent top and bottom heater bank control are the proper tools for this optimization. Silicon surface or interface damage during inert gas anneal can be avoided by addition of a small amount of oxygen.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 342: Symposium G – Rapid Thermal and Integrated Processing III , 1994 , 401
Copyright
Copyright © Materials Research Society 1994

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References

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