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Fracture Strength of Polysilicon thin Films at Stress Concentrations

Published online by Cambridge University Press:  15 March 2011

J. Bagdahn  and
W. N. Sharpe Jr.
J. Bagdahn
Affiliation:
Department of Mechanical Engineering, Johns Hopkins University, 3400 N. Charles Street, Baltimore MD 21218-2681, U.S.A.
W. N. Sharpe Jr.
Affiliation:
Department of Mechanical Engineering, Johns Hopkins University, 3400 N. Charles Street, Baltimore MD 21218-2681, U.S.A.
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Abstract

The fracture strengths of 3.5 microns thick and 20 or 50 microns wide polysilicon specimens were measured. One set of specimens was straight in the gage section, another set had a central hole 5.0 microns in diameter, and the third set had symmetric semicircular notches 2.5 microns in radius on each side. The local maximum fracture stresses of the non- uniform specimens, as calculated from the remote fracture stress with a stress concentration factor, were higher than measured in the straight specimens. This indicates a size effect, which is presumably due to the smaller highly stressed volume or area in the non-uniform specimens.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 687: Symposium B – Materials Science of Microelectromechanical Systems (MEMS) Devices IV , 2001 , B9.7
Copyright
Copyright © Materials Research Society 2002

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References

1. Tsuchiya, T., Tabata, O., Sakata, J. and Taga, Y., Journal of Micromechanical Systems 7 (1), 106 (1998).Google Scholar
2. Ding, J.N., Meng, Y.G. and Wen, S.Z., Journal of Material Research 16 (8), 2223 (2001).Google Scholar
3. Sharpe, W.N., Jackson, K., Hemker, K.J. and Xie, Z., Journal of MEMS 10 (3), 317 (2001).Google Scholar
4. Ding, J.N., Meng, Y.G. and Wen, S.Z., Materials Science and Engineering B83, 42 (2001)Google Scholar
5. Muhlstein, C.L., Brown, S.B. and Ritchie, R.O., Mater. Res. Soc. Proc. 657, Pittsburgh, PA, EE5.8.1. (2000)Google Scholar
6. Kahn, H., Ballarini, R., Mullen, R.L. and Heuer, A.H., Proc. Royal Soc. London A455, 3807 (1999).Google Scholar
7. Peterson, R.E., Stress concentration factors, (John Wiley Publications, New York, 1974).Google Scholar
8. Brückner-Foit, A., Heger, A. und Munz, D., Journal of European Ceramic Society 16, 1027 (1996).Google Scholar
9. Weibull, W., Journal of Applied Mechanics, 293 (1951).Google Scholar
10. ASTM standard C1239-95, Standard practice for reporting uniaxial strength data and estimating Weibull distribution parameters for advanced ceramics.Google Scholar