Hostname: page-component-586b7cd67f-l7hp2 Total loading time: 0 Render date: 2024-11-28T11:05:38.066Z Has data issue: false hasContentIssue false

Fracture mechanism of copper micro-crystals by diamond single crystal

Published online by Cambridge University Press:  31 August 2011

Seisuke Kano
Affiliation:
National Institute of Science and Technology (AIST), JAPAN
Atsushi Korenaga
Affiliation:
National Institute of Science and Technology (AIST), JAPAN
Get access

Abstract

Copper micro-crystal fracture mechanisms were discussed with the machining precisions under the several cutting conditions, such as cutting speed, cutting depth and width of grove formation by the diamond single crystal cutting tool which the scoop face of (100) crystal face. For the cutting test, the copper single at the size of 10 mm in diameter and 5 mm in height as the test piece which cut by single crystal diamond cutting tool with silicon oil on the shaper type ultra-precision cutting machine. Before groves cutting, the specimen surface was cut as flat by cutting-off tool (corner diameter; 50 mm, cutting width; 3.0 mm, scooping angle; 0 degree, and escape angle; 7.0 degree) at the work speed as 4000 mm/min and cutting depth of 5 μm. For the V-shape grove cutting, the flat copper surface was cut with the diamond-point cutting tool (V angle = 90 degree, scooping angle = 0 degree, and escape angle = 7.0 degree) at the work speed as 4-4000 m m/min and cutting depth of 0.1-10 μm for finishing machining. The cut machined surface was observed by optical microscope comparing the grove shapes. The diamond-point tool was also observed by optical microscope. As results of the cutting test of copper single crystal, the machining precision was better for the crystallographic direction of than the direction of under the deeper cutting profiles. The mechanisms of this fracture results considered that the slip plane of (111). On the other hand, shallow grove under 1.0 μm was better tracks scratched for the crystallographic direction of than the direction of . This result was also considered that the slip plane related to the fracture behavior. For copper crystal cutting in nanometric scale, the crystallographic direction was quite important.

Type
Research Article
Copyright
Copyright © Materials Research Society 2011

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1. Komanduri, R., Chandrasekaran, N., Raff, L. M., Wear, 242, 60 (2000).Google Scholar
2. Wang, Chung-Ting, Jian, Sheng-Rui, Shian-Ching Jang, Jason, Lai, Yi-Shao, Yang, Ping-Feng, Applied Surface Science, 255, 3240 (2008).Google Scholar
3. Lin, Zone-Ching and Lin, Yeou-Yih, J. Materials Processing Technology, 115, 313 (2001).Google Scholar
4. Komanduri, R., Chandrasekaran, N., and Raff, L. M., Annals of the CIRP, 48, 1, 67 (1999).Google Scholar
5. Lin, Zone-Ching, Huang, Jen-Ching, J. Materials Processing Technology, 20, 477 (2008).Google Scholar
6. Sze, Y. K., Lee, W. B., Cheung, C. F., To, S., J. materials Processing Tech., 180, 305 (2006).Google Scholar
7. Li, P., Zhang, Z. F., Li, S. X., Wang, Z. G., Acta Materialia, 56, 2212 (2008).Google Scholar
8. Li, X. W., Umakoshi, Y., Gong, B., Li, S. X., Wang, Z. G., Mater. Sci. Eng., A 333, 51 (2002).Google Scholar
9. Dub, S. N., Lim, Y. Y., and Chaudhri, M. M., J. Applied Physics, 107, 4, 043510-1 (2010)Google Scholar