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Fracture in Thin Oxide Films

Published online by Cambridge University Press:  01 February 2011

D. F. Bahr
Affiliation:
Mechanical and Materials Engineering, Washington State University, Pullman WA 99164
A. L. Olson
Affiliation:
Mechanical and Materials Engineering, Washington State University, Pullman WA 99164
K. R. Morasch
Affiliation:
Mechanical and Materials Engineering, Washington State University, Pullman WA 99164
M. S. Kennedy
Affiliation:
Mechanical and Materials Engineering, Washington State University, Pullman WA 99164
D. Rodriguez Marek
Affiliation:
Mechanical and Materials Engineering, Washington State University, Pullman WA 99164
A. Alamr
Affiliation:
Mechanical and Materials Engineering, Washington State University, Pullman WA 99164
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Abstract

In thin film systems, failure often occurs via fracture mechanisms, with either through thickness cracking or interfacial delamination leading to failure of the device or layer. Measuring the stress at which fracture occurs in these thin film systems requires testing methods amicable to both the small scale of the films as well as the complex relationship between the mechanical properties of the film and the substrate. This paper will cover two oxide film systems, a piezoelectric ceramic (PZT) on platinum and passive oxide films (primarily Cr2O3) on stainless steels. Both will be tested with a bulk method (bulge testing in the case of PZT and circumferentially notched tensile bars for the stainless steel) and then with a nanoindentation method developed for testing fracture for hard coatings on soft substrates. The differences in stresses required for failure between the bulk and the nanoscale tests will be discussed in terms of differences in flaw population.

Type
Research Article
Copyright
Copyright © Materials Research Society 2004

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References

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