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Published online by Cambridge University Press: 25 February 2011
Two possible solutions to the problem of nucleus growth encountered in lateral solid-phase epitaxial growth over insulating films are discussed. A stress field originating from the thermal expansion coefficient for Si and SiO2 acts as the driving force behind preferential nucleation. Utilization of underlying Si3N4 films successfully eliminated nucleii growth at topographically irregular portions. In addition, single crystallization of poly-Si nucleii was achieved on SOI structures for the first time. Lateral growth speed (v [cm/s]) of 1.6 × 10 exp(−3.9/kT[eV]) was obtained during high-temperature annealing (≥1000 C ).