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Fluxless Bonding Using Vacuum Ultraviolet and Formic Acid for 3D Interconnects

Published online by Cambridge University Press:  01 February 2011

Katsuyuki Sakuma ,
Naoko Unami ,
shuichi Shoji  and
Jun Mizuno
Katsuyuki Sakuma
Affiliation:
[email protected], IBM, Tokyo Research Laboratory, 1623-14, shimotsuruma, Yamato, Kanagawa, 2428502, Japan, 81-46-215-4255, 81-46-273-7413
Naoko Unami
Affiliation:
[email protected], Waseda University, Tokyo, Japan
shuichi Shoji
Affiliation:
[email protected], Waseda University, Tokyo, Japan
Jun Mizuno
Affiliation:
[email protected], Waseda University, Tokyo, Japan
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Abstract

We have developed a novel surface treatment process using vacuum ultraviolet (VUV) light with a wavelength of 172 nm and formic acid vapor. A previous study showed that the VUV process can help remove the organic contaminants on the bonding surfaces and improve the shear strength. This new work focuses on studying the effects of VUV/O3 and formic acid treatments. The formic acid (HCOOH) vapor removes the metal oxides from the surfaces before the bonding process. Evaporated Cu/Sn and immersion Au were used for the bonding micro-bumps and bonding pads in our evaluations. Different cleaning conditions with VUV/O3, formic acid vapor, or both were compared and evaluated. X-ray Photoelectron Spectroscopy (XPS) was used to study the surface elemental composition of the micro-bumps and pad surfaces before and after the cleaning process. The photoelectron spectra of C1s, Sn3d, and Au4f were obtained with XPS. The XPS results showed the atomic carbon concentrations were significantly decreased by the VUV/O3 treatment process, while the Sn and Au concentrations were increased by the VUV/O3 and formic acid treatment because of the removal of the organic contaminants and metal oxides from the surfaces. The bonding strength of the Cu/Sn bumps was evaluated using a shear test tool. The results shows that the combination of VUV/O3 and formic acid treatment obtains the highest average shear strength among the treatments tested, with a shear strength almost 2.5 times stronger than the untreated samples.

Keywords

bondingpackagingx-ray photoelectron spectroscopy (XPS)
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 1249: Symposia E/F – Advanced Interconnects and Chemical Mechanical Planarization for Micro-and Nanoelectronics , 2010 , 1249-F09-04
Copyright
Copyright © Materials Research Society 2010

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References

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