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Finite Element Analysis of Thermal-Mechanical Stress Induced Failure in Interconnects

Published online by Cambridge University Press:  15 February 2011

X. Yu  and
K. Weide
X. Yu
Affiliation:
Institut für Halbleitertechnologie und Werkstoffe der Elektrotechnik, Universität Hannover, Appelstrasse 11 A, 30167 Hannover, Germany
K. Weide
Affiliation:
Laboratorium für Informationstechnologie, Universität Hannover, Schneiderberg 32, 30167 Hannover, Germany
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Abstract

In this work a study of the nature as well as an evalution of the thermal-mechanical stress in aluminum interconnects was carried out. A theoretical model discribes the atom flux which can be induced by the relaxation of the stress. Based on this theory an algorithm has been developed and integrated into the finite element simulation software. This algorithm allows the calculation of the mass flux divergence and prediction of the failure location before the damage occurs. For the verification of this algorithm an aluminum pad structure sputtered on thermal oxide layer was used. The failure location was correlated with in situ observation during the long term stress tests. Experimental results confirm that the observed structure degradations correspond with the simulations very well.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 539: Symposium M – Fracture & Ductile vs. Brittle Behavior - Theory, Modelling… , 1998 , 269
Copyright
Copyright © Materials Research Society 1999

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