Hostname: page-component-745bb68f8f-d8cs5 Total loading time: 0 Render date: 2025-02-04T00:45:35.558Z Has data issue: false hasContentIssue false
  • English
  • Français

Fabrication of Thermoelectric Modules Using Thermoelectric Pastes and an Additive Technology

Published online by Cambridge University Press:  10 February 2011

Xiaomei Xi ,
Goran Matijasevic ,
Linh Ha  and
Dan Baxter
Xiaomei Xi
Affiliation:
Ormet Corporation, 2236 Rutherford Rd., Carlsbad, CA 92008
Goran Matijasevic
Affiliation:
Ormet Corporation, 2236 Rutherford Rd., Carlsbad, CA 92008
Linh Ha
Affiliation:
Ormet Corporation, 2236 Rutherford Rd., Carlsbad, CA 92008
Dan Baxter
Affiliation:
Ormet Corporation, 2236 Rutherford Rd., Carlsbad, CA 92008
Get access

Abstract

Polymer based thermoelectric pastes have been developed by dispersing metal and metal alloy powders into a polymer binder system. Thermoelectric materials and elements are formed by depositing the pastes into a mold or onto a substrate and subsequently sintering them to form a conductive network with thermoelectric properties. A Seebeck coefficient of 65 μV/°K, and a resistivity of 0.05 Ω-cm have been achieved in the early stage of material development. A novel processing method has also been developed for the fabrication of small size thermoelectric elements and thermoelectric modules with a multitude of thermoelectric couples using these pastes. Thermoelectric elements as small as 250 μm in diameter and 25 μm in thickness have been achieved. Thermoelectric modules with 275 couples/in2have been fabricated using the thermoelectric pastes and the fabrication technique. Further improvement in the material properties and reduction in the sizes of the thermoelectric elements are underway.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 545: Symposium Z – Thermoelectric Materials 1998 - The Next Generation… , 1998 , 143
Copyright
Copyright © Materials Research Society 1999

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1. Sittig, Marshall, “Thermoelectric Materials”, Noyes Data Corporation, USA (1970).Google Scholar
2. Lenoir, B., Cassart, M., Kinany-Alaoui, M., Scherrer, H., and Scherrer, S., “Thermoelectric Properties of Bi-Sb Alloys Prepared by THM”, 13th International Conference On Thermoelectric, P230–235 (1994).CrossRefGoogle Scholar
3. Sugihara, S., Tizuka, M., and Katou, Y., “Thermoelectric properties of Sintered n and p type Bi2Te3”, 13th International Conference On Thermoelectric, P282–285 (1994).Google Scholar
4. Vining, C. B., "Thermoelectric Properties of Pressure-sintered Si0.8Ge0.2 Thermoelectric alloy", J. Appl. Phys. 69 (8), 15 April 1991, P 4333–4340.Google Scholar
5. Godfrey, S., “An Introduction to Thermoelectric Coolers”, Electric Cooling, Vol.2, no. 3, Sept. 1996, P30–32.Google Scholar
6. Ohta, T., Kajikawa, T., U.S. patent 4,902,648.Google Scholar
7. Patent pending.Google Scholar
8.Patent pending.Google Scholar