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Experimental investigation on thermophysical properties of ethylene glycol based copper micro- and nanofluids for heat transfer applications

Published online by Cambridge University Press:  07 August 2015

Nader Nikkam ,
Morteza Ghanbarpour ,
Rahmatollah Khodabandeh  and
Muhammet S. Toprak
Nader Nikkam
Affiliation:
Department of Materials and Nano Physics, KTH- Royal Institute of Technology, SE-16440 Kista, Stockholm, Sweden.
Morteza Ghanbarpour
Affiliation:
Department of Energy Technology, KTH- Royal Institute of Technology, SE-100 44 Stockholm, Sweden
Rahmatollah Khodabandeh
Affiliation:
Department of Energy Technology, KTH- Royal Institute of Technology, SE-100 44 Stockholm, Sweden
Muhammet S. Toprak*
Affiliation:
Department of Materials and Nano Physics, KTH- Royal Institute of Technology, SE-16440 Kista, Stockholm, Sweden.
*
*Email to: [email protected]
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Abstract

The present work reports on the fabrication, experimental and theoretical investigation of thermal conductivity (TC) and viscosity of ethylene glycol (EG) based nanofluids/microfluids (NFs/MFs) containing copper nanoparticles (Cu NPs) and copper microparticles (Cu MPs). Cu NPs (20-40 nm) and Cu MPs (0.5-1.5 μm) were dispersed in EG with particle concentration from 1 wt% to 3 wt% using powerful ultrasonic agitation, and to study the real impact of dispersed particles the use of surface modifier was avoided. The objectives were to study the effect of concentration and impact of size of Cu particles on thermo-physical properties, including thermal TC and viscosity, of EG based Cu NFs/MFs. The physicochemical properties of NPs/MPs and NFs/MFs were characterized by using various techniques. The experimental results exhibited higher TC of NFs and MFs than the EG base liquid. Moreover, Cu NFs displayed higher TC than MFs showing their potential for use in some heat transfer applications. Maxwell effective medium theory as well as Einstein law of viscosity was used to compare the experimental data with the predicted values for estimating the TC and viscosity of Cu NFs/MFs, respectively.

Keywords

thermal conductivitynanoscalecolloid
Type
Articles
Information
MRS Online Proceedings Library (OPL) , Volume 1779: Symposium M – Nanoscale Heat Transport―From Fundamentals to Devices , 2015 , pp. 69 - 74
Copyright
Copyright © Materials Research Society 2015 

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References

REFERENCES

Ahuja, A. S., J. Appl. Phys. 46, 3408 (1975)CrossRefGoogle Scholar
Choi, S.U.S., ASME FED, 231, 99 (1995).Google Scholar
Nikkam, N., Saleemi, M., Li, S., Toprak, M., Haghighi, E.B., Khodabandeh, R. and Palm, B., J. Nanopart. Res. 13 (11), 6201–6 (2011).CrossRefGoogle Scholar
Nikkam, N., Ghanbarpour, M., Saleemi, M., Haghighi, E. B., Khodabandeh, R., Muhammed, M., Palm, B. and Toprak, M. S., Appl Therm Eng, 65 (1-2), 158–165, (2014).CrossRefGoogle Scholar
Nikkam, N., Ghanbarpor, M., Saleemi, M., Toprak, M. S., Muhammed, M. and Khodabandeh, R., Proceedings of the Symposium on Nanoscale Heat Transport—From Fundamentals to Devices, Mater. Res. Soc. Symp. Proc. 1543, Pittsburgh, PA, 2013, pp.165–169.Google Scholar
Singh, S. P., Nikkam, N., Ghanbarpor, M., Toprak, M. S., Muhammed, M. and Khodabandeh, R., Proceedings of the Symposium on Nanoscale Heat Transport—From Fundamentals to Devices, Mater. Res. Soc. Symp. Proc. 1543, Pittsburgh, PA, 2013, pp.143–148.Google Scholar
Haghighi, E. B., Saleemi, M., Nikkam, N., Khodabandeh, R., Toprak, M. S., Muhammed, M and Palm, B., Int Commun Heat Mass, 52, 1 (2014).CrossRefGoogle Scholar
Haghighi, E. B., Saleemi, M., Nikkam, N., Anwar, Z., Lumbreras, I., Behi, M., Mirmohammadi, S. A., Poth, H., Khodabandeh, R., Toprak, M. S., Muhammed, M and Palm, B., Exp Therm Fluid Sci, 49, 114 (2013).CrossRefGoogle Scholar
Nikkam, N., Saleemi, M., Haghighi, E. B., Ghanbarpour, M., Khodabandeh, R., Muhammed, M., Palm, B. and Toprak, M. S., Nano-Micro Lett., 6 (2), 178–189, (2014).CrossRefGoogle Scholar
Nikkam, N., Haghighi, E. B., Saleemi, M., Behi, M., Khodabandeh, R., Muhammed, M., Palm, B. and Toprak, M. S., Int Commun Heat Mass, 55, 38 (2014).CrossRefGoogle Scholar
Yu, W., France, D.M. and Choi, S.U.S., J.L. Heat Transfer Eng. 29 (5), 432–460 (2008).CrossRefGoogle Scholar
Chopkar, M., Sudarshan, S., Das, P.K. and Manna, I., Metallurgical and materials transactions Google Scholar
Lin, Y., Hsiao, P., and Chieng, C., Appl. Phys. Lett. 98, 153105–153105-3 (2011).CrossRefGoogle Scholar
Warrier, P. and Teja, A., Nanoscale Res Lett 6 (247), 1–6 (2011).CrossRefGoogle Scholar
Namburu, P. K., Kulkarni, D.P., Dandekar, A. and Das, D.K., Micro Nano Lett. 2 (3), 67–71 (2007).CrossRefGoogle Scholar
Maxwell, J. C., A Treatise on Electricity and Magnetism, (Clarendon Press, Oxford, 1873) p. 365.Google Scholar
Chow, T. S., Phys. Rev. E 48, 1977 (1993).Google Scholar