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Exothermic and Recursive Reaction of Self-Sinterable Silver Ink for Flexible Electronics

Published online by Cambridge University Press:  29 May 2013

Dong-Youn Shin
Affiliation:
Department of Graphic Arts Information Engineering, Pukyong National University, Busan, 608-739, Republic of Korea.
Sangki Chun
Affiliation:
Information and Electronic Materials Institute, LG Chem Research Park, Daejeon, 305-380, Republic of Korea.
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Abstract

For the construction of highly conductive printed electrodes on a polymeric substrate with a low glass transition temperature, the development of a low temperature sinterable conductive ink has been a crucial issue in printed electronics and display applications. In this work, we introduce a novel type of self-sinterable silver ink, whose sintering is triggered at a low temperature and completed with the aid of its own exothermic reaction, and propose its exothermic reaction mechanism. Although individual components of this self-sinterable silver ink, Ag2O and silver carboxylate, exhibit endothermic behaviors, their mixture form shows a strong exothermic reaction when heated at 150 °C. It is found that the dissociated form of the used silver carboxylate contributes to the reduction of Ag2O to Ag through its recursive reaction and produces silver nanoparticles. The major source of an exothermic reaction results from the nucleation and fusion of silver nanoparticles.

Type
Articles
Copyright
Copyright © Materials Research Society 2013 

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References

REFERENCES

Chun, S., Grudinin, D., Lee, D., Kim, S.-H., Yi, G.-R., and Hwang, I., Chem. Mater. 21, 343 (2009).CrossRefGoogle Scholar
Buffat, Ph., and Borel, J-P., Phys. Rev. A 13, 2287 (1976).CrossRefGoogle Scholar
Akada, Y., Tatsumi, H., Yamaguchi, T., Hirose, A., Morita, T., and Ide, E., Mater. Trans. 49, 1537 (2008).CrossRefGoogle Scholar
Morita, T., Yasuda, Y., Ide, E., Akada, Y., and Hirose, A., Mater. Trans. 49, 2875 (2008).CrossRefGoogle Scholar
Patakfalvi, R., and Dékány, I., J. Therm. Anal. Calorim. 79, 587 (2005).Google Scholar
Shin, D.-Y., Yi, G.-R., Lee, D., Park, J., Lee, Y.-B., Hwang, I., and Chun, S., Nanoscale (2013), DOI: 10.1039/c3nr00962a.Google ScholarPubMed