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Estimation of the Interfacial Fracture Energy of Metal/Polymer System in Microelectronic Packaging

Published online by Cambridge University Press:  21 March 2011

J.Y. Song  and
Jin Yu
J.Y. Song
Affiliation:
Center for Electronic Packaging Materials, Dept. of Materials Science and Engineering, Korea Advanced Institute of Science and Technology, 373-1 Kusong-dong Yusong-gu, Taejon, Korea
Jin Yu
Affiliation:
Center for Electronic Packaging Materials, Dept. of Materials Science and Engineering, Korea Advanced Institute of Science and Technology, 373-1 Kusong-dong Yusong-gu, Taejon, Korea, [email protected]
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Abstract

The interfacial fracture energies of flexible Cu/Cr/Polyimide system were deduced from the T peel test. The T peel strength and peel angle were strongly affected by the metal thickness and the biased rf plasma power density of the polyimide pretreatment. The plastic bending works of metal and polyimide dissipated during peel test were estimated from the direct measurement of maximum root curvatures using the elastoplastic beam analysis. The interfacial fracture energy between Cr and polyimide increased with the rf plasma power density and saturated, but was pretty much independent of the metal film thickness and the peel angle.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 682: Symposium N – Microelectronics and Microsystems Packaging , 2001 , N6.2
Copyright
Copyright © Materials Research Society 2001

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References

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