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Environmental Effects on Crack Characteristics for OSG Materials

Published online by Cambridge University Press:  01 February 2011

Jeannette M. Jacques ,
Ting Y. Tsui ,
Andrew J. McKerrow  and
Robert Kraft
Jeannette M. Jacques
Affiliation:
Silicon Technology Development, Texas Instruments Inc., Dallas, Texas 75243
Ting Y. Tsui
Affiliation:
Silicon Technology Development, Texas Instruments Inc., Dallas, Texas 75243
Andrew J. McKerrow
Affiliation:
Silicon Technology Development, Texas Instruments Inc., Dallas, Texas 75243
Robert Kraft
Affiliation:
Silicon Technology Development, Texas Instruments Inc., Dallas, Texas 75243
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Abstract

To improve capacitance delay performance of the advanced back-end-of-line (BEOL) structures, low dielectric constant organosilicate glass (OSG) has emerged as the predominant choice for intermetal insulator. The material has a characteristic tensile residual stress and low fracture toughness. A potential failure mechanism for this class of low-k dielectric films is catastrophic fracture due to channel cracking. During fabrication, channel cracks can also form in a time-dependent manner due to exposure to a particular environmental condition, commonly known as stress-corrosion cracking. Within this work, the environmental impacts of pressure, ambient, temperature, solution pH, and solvents upon the channel cracking of OSG thin films are characterized. Storage under high vacuum conditions and exposure to flowing dry nitrogen gas can significantly lower crack propagation rates. Cracking rates experience little fluctuation as a function of solution pH; however, exposure to aqueous solutions can increase the growth rate by three orders of magnitude.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 875: Symposium O – Thin Films - Stresses and Mechanical Properties XI , 2005 , O10.6
Copyright
Copyright © Materials Research Society 2005

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References

1. Liu, X.H., Shaw, T.M., Lane, M.W., Rosenberg, R.R., Lane, S.L., Doyle, J.P., Restaino, D., Vogt, S.F., and Edelstein, D.C.. IEEE Proceedings of the International Interconnect Technology Conference 2004 (Pg.93–95), San Francisco, CA.Google Scholar
2. Cook, R.F. and Liniger, E.G., J. Electrochem. Soc. 146 (12), 4439 (1999).Google Scholar
3. Cook, R.F. and Zuo, Z., Materials Research Society (MRS) Bulletin, January 2002, 45.Google Scholar
4. Cook, R.F., Mat. Sci. and Eng., A, 260, 29 (1999).Google Scholar
5. Jacques, J.M., Tsui, T.Y., McKerrow, A.J., and Kraft, R., Mater. Res. Soc. Symp. B3. 8–6 (2005). (Submitted for Publication)Google Scholar
6. Wiederhorn, S.M. and Johnson, H., J. Appl. Phys. 42 (2), 681 (1971).Google Scholar
7. Wiederhorn, S.M., Johnson, H., Diness, A.M., and Heuer, A.H., J. Amer. Ceram. Soc. 57 (8), 336 (1974).Google Scholar
8. Wiederhorn, S.M. and Bolz, L.H., J. Amer. Ceram. Soc. 53 (10), 543 (1970).Google Scholar
9. Wiederhorn, S.M., J. Amer. Ceram. Soc. 50 (8) 407 (1967).Google Scholar
10. Guyer, E.P. and Dauskardt, R.H., Nature Materials 3, 53 (2004).Google Scholar
11. Guyer, E.P. and Dauskardt, R.H.. IEEE Proceedings of the International Interconnect Technology Conference 2003 (Pg. 89–91), San Francisco, CA.Google Scholar
12. Guyer, E.P. and Dauskardt, R.H.. IEEE Proceedings of the International Interconnect Technology Conference 2004 (Pg. 236–238), San Francisco, CA.Google Scholar
13. Michalske, T.A. and Freiman, S.W., Nature 295, 511 (1982).Google Scholar
14. Lane, M.W., Snodgrass, J.M., and Dauskardt, R.H., Microelectronics Reli. 41, 1615 (2001).Google Scholar
15. Suratwala, T.I., Steele, R.A., Wilke, G.D., Campbell, J.H., and Takeuchi, K., J. Non-Crystalline Solids 263&264, 213 (2000).Google Scholar
16. Suratwala, T.I. and Steele, R.A., J. Non-Crystalline Solids 316 (1), 174 (2003).Google Scholar
17. Thomson, J.F, Biological Effects of Deuterium (The Macmillan Company, New York, 1963).Google Scholar
18. Michalske, T.A. and Bunker, B.C., J. Am. Ceram. Soc. 76 (10), 2613 (1993).Google Scholar