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Enhanced Computer Modelling for High Temperature Microwave Processing of Ceramic Materials

Published online by Cambridge University Press:  10 February 2011

M. P. Craven
Affiliation:
University of Nottingham, University Park, Nottingham, NG7 2RD, U.K. Department of Electrical and Electronic Engineering, [email protected]
T. E. Cross
Affiliation:
University of Nottingham, University Park, Nottingham, NG7 2RD, U.K. Department of Electrical and Electronic Engineering, [email protected]
J. G. P. Binner
Affiliation:
University of Nottingham, University Park, Nottingham, NG7 2RD, U.K. Department of Materials Engineering and Materials Design
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Abstract

A new software package is described for 2-Dimensional modelling of microwave heating. It is particularly suited to the high temperature heating of ceramics, where electrical and thermal properties are strongly dependent on temperature. The described program, x_tlm, runs under Xwindows, which allows a microwave cavity and its contents to be entered graphically and stored as a schematic diagram. The diagram is automatically converted into a mesh format for simulation using a topology independent Transmission Line Modelling formulation. Temperature dependencies of material properties are specified as polynomial functions of temperature. Surface heat loss by the radiation mechanism, which dominates at higher temperatures, is also introduced into the model.

Type
Research Article
Copyright
Copyright © Materials Research Society 1996

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References

1. Tian, Y.L., Feng, J.H., Sun, L.C. and Tu, C.J., “Computer modeling of two dimensional temperature distributions in microwave heated ceramics”, in Beatty, R.L. et al (Eds.) “Microwave Processing of Materials III”, Mat. Res. Soc. Symp. Proc. Vol 269, pp231243, 1992 Google Scholar
2. Kron, G., “Equivalent circuit of the field equations of Maxwell”, Proc. IRE, Vol.32, pp289299, 1944Google Scholar
3. Johns, P.B. and Beurle, R.L., “Numerical solution of two-dimensional scattering problems using transmission-line matrix”, Proc. IEE, Vol.188, pp12031208, 1971Google Scholar
4. Trenkic, V., Christopoulos, C. and Binner, J.G.P, “The application of the transmission-line modelling technique (TLM) in combined thermal and magnetic problems”, in LEWIS, R.W. (Ed.) “Numerical Methods in Thermal Problems”, Vol. VIII, Part 2, (Pineridge Press, Swansea, UK), pp12631274, 1993 Google Scholar