Hostname: page-component-745bb68f8f-l4dxg Total loading time: 0 Render date: 2025-01-12T04:17:51.318Z Has data issue: false hasContentIssue false
  • English
  • Français

Electronic Packaging Education in U.S.

Published online by Cambridge University Press:  21 February 2011

Rao R. Tummala
Rao R. Tummala*
Affiliation:
Georgia Institute of Technology, Packaging Research Center, 813 Ferst Drive NW, Atlanta, GA 30332–0560
Get access

Abstract

The loss of U.S. electronics market share during the last three decades is attributed to both the engineering education and the research emphasis away from manufacturing and systems. The engineering education in U.S., in spite of great progress during the last decade, is incomplete and fragmented and requires a comprehensive and system-level strategy.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 390: Symposium S – Electronic Packaging Materials Science VIII , 1995 , 9
Copyright
Copyright © Materials Research Society 1995

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1. Li, Che-Yu, IEEE Transactions on Components, Hybrids, and Manufacturing Technology, 16, 241–247 (1993).Google Scholar
2. Hsu, T.R., Bar-Cohen, A., Nakayama, W., Proceedings of International Intersociety Electronic Packaging Conference, Maui, HI, 2, 583–609, (1995).Google Scholar