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Electron Microscope Observations of Mechanisms of thin Film Delamination from Substrates

Published online by Cambridge University Press:  21 February 2011

D. Goyal  and
A. H. King
D. Goyal
Affiliation:
Department of Materials Science and Engineering, State University of New York at Stony Brook, Stony Brook NY 11794-2275.
A. H. King
Affiliation:
Department of Materials Science and Engineering, State University of New York at Stony Brook, Stony Brook NY 11794-2275.
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Abstract

Transmission electron microscope techniques have been applied to the problem of thin film delamination from substrates during film formation. Model systems involving metal films on single crystal silicon substrates have been used and it is found that delamination of the films is initiated by the formation of damage in the substrate. This understanding removes some of the fundamental problems regarding delamination.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 119: Symposium F – Adhesions in Solids , 1988 , 291
Copyright
Copyright © Materials Research Society 1988

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References

1. Srolovitz, D.J. and Anderson, M.P., Acta Met. 32, 1098 (1984).Google Scholar
2. Goyal, D., King, A.H. and Bilello, J.C., Mater. Res. Soc. Symposium Series (in press).Google Scholar
3. Booker, G.R. and Stickler, R., Brit. J. Apph. Phys. 13, 446 (1962).Google Scholar
4. Bravman, J.C. and Sinclair, R., J. Electr. Micr. Tech., 1, 53 (1984).CrossRefGoogle Scholar