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Electromigration in Single-Crystal Aluminum Lines Pre-Damaged by Nanoindentation

Published online by Cambridge University Press:  15 February 2011

Young-Chang Joo ,
Shefford P. Baker ,
Michael P. Knaufß  and
Eduard Arzt
Young-Chang Joo
Affiliation:
Max-Planck-Institut fur Metallforschung and Institut for Metallkunde, University of Stuttgart, D-70174 Stuttgart, Germany
Shefford P. Baker
Affiliation:
Max-Planck-Institut fur Metallforschung and Institut for Metallkunde, University of Stuttgart, D-70174 Stuttgart, Germany
Michael P. Knaufß
Affiliation:
Max-Planck-Institut fur Metallforschung and Institut for Metallkunde, University of Stuttgart, D-70174 Stuttgart, Germany
Eduard Arzt
Affiliation:
Max-Planck-Institut fur Metallforschung and Institut for Metallkunde, University of Stuttgart, D-70174 Stuttgart, Germany
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Abstract

Electromigration tests have been performed on single-crystal Al lines which were predamaged by rows of submicrometer-depth indentations made using a nanoindentation device. Indentations were placed close to each other so that their plastic deformation zones overlapped. During subsequent electromigration testing at 280°C and I to 2 MA/cm2, no damage was observed in non-indented single-crystal lines, while the indented lines showed electromigrationinduced voids at the cathode-side ends of the indented areas, and hillocks at the anode-side ends. The voids grew and moved away from the indentations towards the cathode. Fhe electromigration damage morphology of the indented lines indicates that the mechanical damage generates a local fast diffusion path in the single-crystal lines, which is believed to be due to dislocation core diffusion. A minimum indentation row length was observed, below which no void formed. This electromigration behavior is found to be phenomenologically similar to that of polygranular clusters in near-bamboo lines.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 428: Symposium L – Materials Reliability in Microelectronics VI , 1996 , 225
Copyright
Copyright © Materials Research Society 1996

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