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Electrochemical Investigation into the Dissolution Mechanism of Anodic Oxide Films on Silicon

Published online by Cambridge University Press:  13 May 2013

Dongqing Liu  and
Daniel J. Blackwood
Dongqing Liu
Affiliation:
Department of Materials Science and Engineering, National University of Singapore, Block E3A, 7 Engineering Drive 1, Singapore 117574
Daniel J. Blackwood
Affiliation:
Department of Materials Science and Engineering, National University of Singapore, Block E3A, 7 Engineering Drive 1, Singapore 117574
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Abstract

Electropolishing of p-type silicon has been investigated over a wide range of HF concentrations (0.01-11 wt. %) by potentiodynamic polarization. Oxide dissolution rates were determined from the plateau current densities observed in the electropolishing region during the reverse sweeps; i.e. where the growth and dissolution rates of the anodic oxide film are believed to be equal. Based on the shape of the CV curves the oxide dissolution process was treated as a corrosion process controlled by the dissolution of a salt film, that is its rate controlled by removal of dissolved products away from the surface rather than reactants to the surface as previously proposed. Although a contribution from HF from bulk to surface cannot be completely ruled out, because the removal of the initial dissolution product can be by either mass transport or further chemical reaction with HF species in solution this mechanism is capable of explaining the dependence of the dissolution rate on HF concentration for the whole range investigated.

Keywords

Sipassivationsurface reaction
Type
Articles
Information
MRS Online Proceedings Library (OPL) , Volume 1542: Symposium G – Electrochemical Interfaces for Energy Storage and Conversion— Fundamental Insights from Experiments to Computations , 2013 , mrss13-1542-g05-01
Copyright
Copyright © Materials Research Society 2013 

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References

REFERENCES

Buhler, J., Steiner, F.P., Baltes, H., J Micromech Microeng, 7 (1997) R1–R13.CrossRefGoogle Scholar
Lehmann, V., The electrochemistry of silicon: instrumentation, science, materials and applications, Wiley-VCH, 2002.CrossRefGoogle Scholar
Verhaverbeke, S., Teerlinck, I., Vinckier, C., Stevens, G., Cartuyvels, R., Heyns, M.M., J Electrochem Soc, 141 (1994) 2852–2857.CrossRefGoogle Scholar
Zhang, X.G., Collins, S.D., Smith, R.L., J Electrochem Soc, 136 (1989) 1561–1565.CrossRefGoogle Scholar
Ozanam, F., Chazalviel, J.N., J Electron Spectrosc, 64-5 (1993) 395–402.CrossRefGoogle Scholar
Chazalviel, J.N., Etman, M., Ozanam, F., J Electroanal Chem, 297 (1991) 533–540.CrossRefGoogle Scholar
Peiner, E., Schlachetzki, A., J Electrochem Soc, 139 (1992) 552–557.CrossRefGoogle Scholar
Properties of Hydrofluoric Acid, Honeywell Specialty Chemicals, 2002.Google Scholar
Southampton Electrochemistry Group, Instrumental methods in electrochemistry, Ellis- Horwood Publishing, 1990.Google Scholar
van den Meerakker, J.E.A.M., Mellier, M.R.L., J Electrochem Soc, 148 (2001) G166–G171.CrossRefGoogle Scholar
Warren, L.J., Anal Chim Acta, 53 (1971) 199–202.CrossRefGoogle Scholar
Liu, D.Q., Blackwood, D.J., Electrochim Acta http://dx.doi.org/10.1016/j.electacta.2013.04.024.CrossRefGoogle Scholar
Campbell, S.A., Lewerenz, H.J., Semiconductor micromachining: Fundamental electrochemistry and physics, Wiley, 1998.Google Scholar
Serre, C., Barret, S., Herino, R., J Electroanal Chem, 370 (1994) 145–149.CrossRefGoogle Scholar
Verhaverbeke, S., Bender, H., Meuris, M., Mertens, P.W., Schmidt, H.F., Heyns, M.M., Mater Res Soc Symp Proc, 315 (1993) 457–466.CrossRefGoogle Scholar