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Electrochemical Insertion of Li into Sr2MO2Cu2S2 (M = Mn, Co, Ni)

Published online by Cambridge University Press:  26 February 2011

Sylvio Indris
Affiliation:
[email protected], State University of New York at Stony Brook, Chemistry Department, 100 Nichols Rd., Stony Brook, NY, 11794, United States
Dongli Zeng
Affiliation:
[email protected], State University of New York at Stony Brook, Chemistry Department, 100 Nichols Rd., Stony Brook, NY, 11794, United States
Jordi Cabana
Affiliation:
[email protected], State University of New York at Stony Brook, Chemistry Department, 100 Nichols Rd., Stony Brook, NY, 11794, United States
Catherine F. Smura
Affiliation:
[email protected], University of Oxford, Department of Chemistry, South Parks Road, Oxford, OX1 3QR, United Kingdom
Oliver J. Rutt
Affiliation:
[email protected], University of Oxford, Department of Chemistry, South Parks Road, Oxford, OX1 3QR, United Kingdom
Simon J. Clarke
Affiliation:
[email protected], University of Oxford, Department of Chemistry, South Parks Road, Oxford, OX1 3QR, United Kingdom
Clare P. Grey
Affiliation:
[email protected], State University of New York at Stony Brook, Chemistry Department, 100 Nichols Rd., Stony Brook, NY, 11794, United States
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Abstract

The layered oxysulfides Sr2MO2Cu2S2 (M = Mn, Co, Ni) consist of alternating perovskite-type Sr2MO2 layers and copper sulfide layers. We studied the electrochemical insertion of Li into these three samples. By this we were able to study the influence of the nature of the transition metal on the Li insertion process which appears to be at least partially reversible. While the Mn compound clearly shows a Cu-Li exchange reaction, the electrochemical process for the two other compounds is more complex. The lithiated materials were studied by 7Li MAS NMR.

Type
Research Article
Copyright
Copyright © Materials Research Society 2007

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References

REFERENCES

1. Gál, Z.A., Rutt, O.J., Smura, C.F., Overton, T.P., Barrier, N., Clarke, S.J., and Hadermann, J., J. Am. Chem. Soc. 128, 8530 (2006).Google Scholar
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