Published online by Cambridge University Press: 25 February 2011
THERMID, made of acetylene-terminated polyimide oligomers, was developed by National Starch & Chemical Co. It is capable of forming thicker deposits than conventional polyimides. It is a candidate for a broad array of electronic and optoelectronic applications, including passivation coating, alpha-particle barrier, interlayer dielectric, encapsulation of discrete devices and IC, optical waveguide, and multilayer dielectric for thin hybrids. The study and evaluation of electrical and optical properties of THERMID polyimide give more support to their application in the semiconductor industry.