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The Effects of the Mechanical Properties of the Confinement Material on Electromigration in Metallic Interconnects

Published online by Cambridge University Press:  17 March 2011

Stefan P. Hau-Riege  and
Carl V. Thompson
Stefan P. Hau-Riege
Affiliation:
Department of Materials Science and Engineering, M.I.T., Cambridge, Massachusetts 02139
Carl V. Thompson
Affiliation:
Department of Materials Science and Engineering, M.I.T., Cambridge, Massachusetts 02139
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Abstract

New low-dielectric-constant inter-level dielectrics are being investigated as alternatives to SiO2 for future integrated circuits. In general, these materials have very different mechanical properties from SiO2. In the standard model, electromigration-induced stress evolution caused by changes in the number of available lattice sites in interconnects is described by an effective elastic modulus, B. Finite element calculations have been carried out to obtain B as a function of differences in the modulus, E, of interlevel dielectrics, for several stress-free homogeneous dilational strain configurations, for several line aspect ratios, and for different metallization schemes. In contradiction to earlier models, we find that for Cu-based metallization schemes with liners, a decrease in E by nearly two orders of magnitude has a relatively small effect on B, changing it by less than a factor of 2. However, B, and therefore the reliability of Cu interconnects can be strongly dependent on the modulus and thickness of the liner material.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 612: Symposium D – Materials, Technology & Reliability for Advanced Interconnects.. , 2000 , D10.2.1
Copyright
Copyright © Materials Research Society 2000

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