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Effects of Process Parameters on the Adhesion of Copper Film on Polyethylene Tetrephthalate(Pet) Substrate Prepared by ECRMOCVD Coupled with a Periodic DC Bias

Published online by Cambridge University Press:  01 February 2011

Jin Hyun ,
Bup Ju Jeon ,
Dongjin Byun  and
Joong Kee Lee
Jin Hyun
Affiliation:
Eco-Nano Research Center, Korea Institute of Science and Technology, P.O. Box 131, Cheongyang Seoul 130–650, Korea
Bup Ju Jeon
Affiliation:
Dept. of Materials Science & Engineering, Korea University, Seoul, 136–701, Korea
Dongjin Byun
Affiliation:
Eco-Nano Research Center, Korea Institute of Science and Technology, P.O. Box 131, Cheongyang Seoul 130–650, Korea
Joong Kee Lee
Affiliation:
Dept. of Materials Science & Engineering, Korea University, Seoul, 136–701, Korea
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Abstract

Characteristics of Cu/C:H films on the PET substrate prepared by ECR-MOCVD coupled with a DC bias under Cu(hfac)2-Ar-H2 was investigated with special attention to process parameters. Our results showed that the Cu/C:H film has strongly adhere with the polymer substrate by chemical bonding and exhibited wide range of electrical conductivity that could be controlled by process parameters. The increase in H2/Ar ratio, microwave power and negative DC bias voltage brought on the higher pulling strength between Cu/C:H films and PET substrate. The effects of surface pretreatments of polymer substrate on pulling strength were insignificant in the range of our experimental range.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 795: Symposium U – Thin Films - Stresses and Mechanical Properties X , 2003 , U8.5
Copyright
Copyright © Materials Research Society 2004

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References

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