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Effect of Thermal Treatment on the Hardness and Fracture Toughness of Sputter Deposited Bi-Layered Thin Films on Silicon

Published online by Cambridge University Press:  10 February 2011

M. Manoharan ,
B. Narayanan  and
G. Muralidharan
M. Manoharan
Affiliation:
Division of Materials Engineering, School of Applied Science, Nanyang Technological University, Singapore- 639798
B. Narayanan
Affiliation:
Multi-Chip Module Group, Institute of Microelectronics, 11 Science Park Rd., Science Park II, Singapore–117685
G. Muralidharan
Affiliation:
Failure Analysis and Reliability Department, Institute of Microelectronics, 11 Science Park Rd., Science Park II, Singapore–117685
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Abstract

Microhardness testing is widely used for characterizing the mechanical properties of both bulk materials and thin films. Although this technique is usually associated with hardness measurements, fracture properties of brittle materials can also be studied with cracking associated with microhardness indentations. It is well known that the length of radial cracks emanating from the comers of indents made with Vickers and Berkovich indenters is related to the fracture toughness of the material. In the present study, microhardness testing has been used to follow the evolution of the mechanical properties of a 10 nm.Cu/200 nm. Ni(V)/300 nm. Al(Cu) thin film deposited on a Si substrate. Composite hardness and fracture toughness have been followed as a function of heat treatment temperatures and times and were found to be dependent on both variables. The roles of residual stresses, interdiffusion, and intermediate phase formation in the observed variation in hardness and fracture toughness are discussed.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 516: Symposium E – Low Dielectric Constant Materials IV , January 1998 , 325
Copyright
Copyright © Materials Research Society 1998

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References

1. Edelstein, A., Everett, R. K., Richardson, G. Y., Quadri, S. B., Altman, E. I., Foley, J. C. and Perepezko, J. H., J. Appl. Phys., 76 7850 (1994).Google Scholar
2. Colgan, E. G., Nastasi, M. and Mayer, J. W., J. Appl. Phys., 58 4125 (1985).Google Scholar
3. Ma, E., Thompson, C. V., Clevenger, L. A., J. Appl. Phys., 69 2211 (1991).10.1063/1.348722Google Scholar
4. Cook, R. F. and Pharr, G. M., J. Am. Ceram. Soc., 73 787 (1990).Google Scholar
5. Gruninger, M. F., Lawn, B. R. and Farabaugh, E. N., J. Am. Ceram. Soc., 70 344 (1987).Google Scholar
6. Lawn, B. R., Evans, A. G. and Marshall, D. B., J. Am. Ceram. Soc., 63 574 (1980).10.1111/j.1151-2916.1980.tb10768.xGoogle Scholar
7. Burnett, P. J. and Rickerby, D. S., Thin Solid Films, 148 41 (1987).Google Scholar
8. Tsui, T. Y., Oliver, W. C. and Pharr, G. M., Mat. Res. Soc. Symp. Proc., 436 207 (1997).10.1557/PROC-436-207Google Scholar
9. Holloway, Gorrell P. and Jerman, H., Mat. Res. Soc. Symp. Proc., 436 27 (1997).Google Scholar
10. Tsui, T. Y., Oliver, W. C. and Pharr, G. M., J. Mater. Res., 11 752 (1996).Google Scholar
11. Boyer, E. and Gall, T. L., Metals Handbook Desk Edition, ASM, Metals Park, 1985, 6.6–6.7. Google Scholar