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Effect of SC-1 Process Parameters on Particle Removal and Surface Metallic Contamination
Published online by Cambridge University Press: 15 February 2011
Abstract
The effect of bath temperature, megasonic power, and NH4-OH:H2O ratio are studied for particle removal efficiency, surface roughness, and surface Fe concentration in SC-1 cleaning solutions. Experimental results are presented which show removal efficiencies better than 97% on bare silicon wafers for optimized process conditions. These results are related to the etch rate of thermal oxides and a model is developed for reducing surface roughness and minimizing Fe contamination levels while maximizing particle removal efficiency.
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- Research Article
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- Copyright © Materials Research Society 1995
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