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Effect of partial filling of the structural vacant sites on the thermoelectric properties of Zr0.25Hf0.75NiSn half-Heusler alloy

Published online by Cambridge University Press:  01 February 2011

Julien Pierre Amelie Makongo Mangan ,
Dinesh Misra ,
Nathan J. Takas ,
Kevin L. Stokes ,
Heike Gabrisch  and
Pierre F. P. Poudeu
Julien Pierre Amelie Makongo Mangan
Affiliation:
[email protected], University of New Orleans, Advanced Materials Research Institute, New Orleans, Louisiana, United States
Dinesh Misra
Affiliation:
[email protected]@gmail.com, University of New Orleans, Advanced Materials Research Institute, New Orleans, Louisiana, United States
Nathan J. Takas
Affiliation:
[email protected], University of New Orleans, Advanced Materials Research Institute, New Orleans, Louisiana, United States
Kevin L. Stokes
Affiliation:
[email protected], University of New Orleans, Departement of Physics and the Advanced Materials Research Institute, New Orleans, Louisiana, United States
Heike Gabrisch
Affiliation:
[email protected], University of New Orleans, Department of Chemistry and the Advanced Materials Research Institute, New Orleans, Louisiana, United States
Pierre F. P. Poudeu
Affiliation:
[email protected], University of New Orleans, Department of Chemistry and the Advanced Materials Research Institute, New Orleans, Louisiana, United States
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Abstract

Composites containing mainly-half-Heusler MNiSn (HH) and full-Heusler MNi2Sn (FH) were prepared by solid state reaction of a mixture of polycrystalline bulk HH alloy with various concentrations of Ni up to 10 wt.%. Electrical conductivities, thermal conductivities and thermopowers of spark plasma sintered specimens of the as synthesized composite materials were measured in the temperature range from 300 K to 750 K. The conduction type of the composite changes from semiconductor to semimetal for Ni concentrations up to 2 wt.% and from semimetal to metal for higher Ni concentrations above 5 wt.%. A strong reduction in lattice thermal conductivity was observed for the composite containing 10 wt. % Ni inclusions.

Keywords

compositethermoelectrictransmission electron microscopy (TEM)
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 1267: Symposium DD – Thermoelectric Materials 2010-Growth, Properties, Novel Characterization Methods and Applications , 2010 , 1267-DD05-12
Copyright
Copyright © Materials Research Society 2010

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References

[1] Aliev, F. G. Brandt, N. B. Moshchalkov, V. V. Scolozdra, R. V. Belogorokhov, A. I. Z. Phys. B 75 167 (1989).10.1007/BF01307996Google Scholar
[2] Aliev, F. G. Kozyrkov, V. V. Moshchalkov, V. V. Scolozdra, R. V. Durczewski, K. Z. Phys. B 80 353 (1990).Google Scholar
[3] Poon, S. J. in semiconductors and Semimetals, Vol. 70, edited by Tritt, T. M. (Academic, San Diego, 2000), p.37.Google Scholar
[4] Simonson, J. W. Poon, S. J. J. Phys.: Condens. Matter 20, 255220 (2008).Google Scholar
[5] Shen, Q. Chen, L. Goto, T. Hirai, T. Yang, J. Meisner, G. P. Uher, C. Appl. Phys. Lett. 79, 4165 (2001).10.1063/1.1425459Google Scholar
[6] Hohl, H. Ramirez, A. P. Goldmann, C. Ernst, G..Wölfing, B., Bucher, E. J. Phys.: Condens. Matter 11, 1697 (1999).Google Scholar
[7] Romaka, V. A. Shelyapina, M. G. Frushart, D. Gorelenko, YU. K. Stadnyk, YU. V. Romaka, L. P. Chekurin, V. F. Horin, A. M. Ukr. J. Phys., 52 39 (2007).Google Scholar
[8] Goldsmid, H. J. Douglas, R. W. Brit. J. Appl. Phys. 5, 386 (1954).10.1088/0508-3443/5/11/303Google Scholar
[9] Sootsman, J. R. Pcionek, R. J. Kong, H. Uher, C. Kanatzidis, M. G. Chem. Mater. 18 4993 (2006).10.1021/cm0612090Google Scholar
[10] Yamashita, O. Sadatomi, N. J. Appl. Phys. 88, 245 (2000).10.1063/1.373648Google Scholar
[11] Kim, W. Majumdar, A. J. Appl. Phys. 99, 084306 (2006).10.1063/1.2188251Google Scholar
[12] Morimura, T. Hasaka, M. Yoshimoto, M. J. Alloys Compd. 416 155 (2006).10.1016/j.jallcom.2005.08.043Google Scholar