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Effect of Aqueous Solution Chemistry on the Accelerated Crackingof Lithographically Patterned Arrays of Copper and NanoporousThin-Films

Published online by Cambridge University Press:  17 March 2011

E. P. Guyer  and
R. H. Dauskardt
E. P. Guyer
Affiliation:
Department of Materials Science and Engineering, Stanford University 416 Escondido Mall, Stanford, CA 94305
R. H. Dauskardt
Affiliation:
Department of Materials Science and Engineering, Stanford University 416 Escondido Mall, Stanford, CA 94305
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Abstract

The effect of moisture and aqueous solution chemistry on the rate of crackgrowth in lithographically patterned arrays of copper and low dielectricconstant (LKD) materials is reported. Crack growth in the directionorthogonal to the features is demonstrated to fail at significantlyincreased loads compared to parallel cracking. Decreasing feature width isalso shown to increase the structures resistance to fracture, particularlyat reduced loads. The chemical interactions and mechanisms of energydissipation are discussed.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 812: Symposium F – Materials, Technology and Reliability for Advanced Interconnects and Low-k Dielectrics-2004 , 2004 , F6.4
Copyright
Copyright © Materials Research Society 2004

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References

1. Iacopi, F., Patz, M., Vos, I., Tokei, Z., Sijmus, B., Le, Q., Sleeckx, E., Eyckens, B., Struyf, H., Das, A., and Maex, K., Impact of LKD5109 low-k to cap/liner interfaces in single damascene process and performance. Microelectronic Engineering, 2003. 70(2/4): p. 293–301.CrossRefGoogle Scholar
2. Wiederhorn, S.M. and Johnson, H., Effect of electrolyte pH on crack propagation in glass. Journal of the American Ceramic Society, 1973. 56(4): p. 192–7.CrossRefGoogle Scholar
3. Wiederhorn, S.M., Influence of water vapor on crack propagation in soda-lime glass. Journal of American Ceramic Society, 1967. 50(8): p. 407–14.CrossRefGoogle Scholar
4. Guyer, E.P. and Dauskardt, R.H., Fracture of nanoporous thin-film glasses. Nature Materials, 2004. 3(1).CrossRefGoogle ScholarPubMed
5. Lin, Y., Vlassak, J., Tsui, T., and McKerrow, A.. Environmental effects on subcritical delamination of dielectric and metal films from organosilicate glass (OSG) thin films. 2003: Warrendale, PA, USA: Mater. Res. Soc, 2003.CrossRefGoogle Scholar
6. Litteken, C.S., The effects of multi-dimensional constraint on the adhesion of thinfilms and patterned structures, Ph.D. Dissertation in Materials Science & Engineering. 2004, Stanford University.Google Scholar
7. Dauskardt, R.H., Lane, M., Ma, Q., and Krishna, N., Adhesion and debonding of multi-layer thin film structures. Engineering Fracture Mechanics, 1998. 61(1): p. 141–62.CrossRefGoogle Scholar
8. Michalske, T.A. and Freiman, S.W., A molecular interpretation of stress corrosion in silica. Nature, 1982. 295(5849): p. 511–12.CrossRefGoogle Scholar
9. Lane, M., Interface fracture. Annual Review of Materials Research, 2003. 33: p. 29–54.CrossRefGoogle Scholar