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Early yielding and stress recovery in (111) and (100) texture components in Cu thin films determined using synchrotron x-ray diffraction

Published online by Cambridge University Press:  01 February 2011

D. E. Nowak  and
S. P. Baker
D. E. Nowak
Affiliation:
Cornell University, Department of Materials Science and Engineering, Bard Hall, Ithaca, NY 14853, U.S.A.
S. P. Baker
Affiliation:
Cornell University, Department of Materials Science and Engineering, Bard Hall, Ithaca, NY 14853, U.S.A.
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Abstract

Synchrotron x-ray diffraction experiments were used to study the thermomechanical behavior of individual texture components in passivated Cu thin films. Films were deposited to a thickness of 500 nm on SiNx barrier layers on Si substrates and then passivated with SiNx. The films were highly textured with grains having (111) or (100) planes parallel to the plane of the film. In-plane film stresses were determined separately in the two texture components as a function of temperature during thermal cycles and also during isothermal holds at 140°C. The results are compared to models of yield behavior and anelastic recovery.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 795: Symposium U – Thin Films - Stresses and Mechanical Properties X , 2003 , U10.5
Copyright
Copyright © Materials Research Society 2004

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References

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