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Deactivation of Ultra Shallow B and BF2 Profiles After Non-melt Laser Annealing
Published online by Cambridge University Press: 01 February 2011
Abstract
Ultra-shallow B and BF2 implants in silicon pre-amorphised with Ge have been activated using a scanning non-melt laser. The implants were activated either by using 1 or 10 laser scans. Isochronal 60s post-laser annealing between 700-1000°C were then undertaken to study the deactivation and reactivation of the B. Both B and BF2 samples were implanted with a dose of 1x1015 B cm-2 at an effective energy of 500eV. The presence of F from the BF2 implants, which is superimposed over the boron profile increases the sheet resistance of the initial fabricated junction (from 600-700 Ω/sq from B implants only to 750-1100 Ω/sq for BF2 implants). Fluorine also changes the deactivation and reactivation behaviour of the boron during the post-anneals by increasing the amount of deactivation of the boron.
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- Copyright © Materials Research Society 2006
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