Hostname: page-component-586b7cd67f-l7hp2 Total loading time: 0 Render date: 2024-11-24T09:24:00.713Z Has data issue: false hasContentIssue false
  • English
  • Français

Current Transport Study of Schottky and P-N Junction Solar Cells Using Metal-Induced Growth Poly-Si Thin Films

Published online by Cambridge University Press:  01 February 2011

Chunhai Ji ,
Joon-Dong Kim  and
Wayne A. Anderson
Chunhai Ji
Affiliation:
University at Buffalo, The State University of New York, Dept of Electrical Engineering, Buffalo, NY
Joon-Dong Kim
Affiliation:
University at Buffalo, The State University of New York, Dept of Electrical Engineering, Buffalo, NY
Wayne A. Anderson
Affiliation:
University at Buffalo, The State University of New York, Dept of Electrical Engineering, Buffalo, NY
Get access

Abstract

Poly-Si thin films deposited at low temperature by using the metal-induced growth (MIG) method have the advantage of less metal impurity contaminations and relative large grains with preferred crystal orientation of (220). In recent research, the Schottky solar diode made of MIG poly-Si shows Jsc of 12 mA/cm2 and Voc of 0.214V. In this paper, current transport mechanisms were studied by current-voltage-temperature (I-V-T) testing from 100 K to 400K. For the samples deposited by a one-step sputtering process, the large value of ideality factor (n) and abnormal increase of barrier height with the temperature implies that the current transport mechanism does not follow the pure thermionic-emission theory, which was proven to be thermionic-field emission due to the highly doped Si film. By using a two-step sputtering process, the ideality factor and Au-Schottky barrier height at room temperature were about 1.5 and 0.7 eV, which was improved from one-step sputtering. Hydrogenation by electron cyclotron resonance (ECR) plasma can further improve the Schottky diode ideality factor and barrier height. Although a low-level Phosphors-doped Si target was used for poly-Si thin film deposition, a thermionic-field emission mechanism was still found by plotting the activation energy (E0) versus the testing temperature range. Capacitance-voltage (C-V) analysis revealed an unexpected carrier density of 1017 cm−3 level, which is 1000 times higher than the doping density level in the Si film. “Oxygen thermal donor” effect was assumed due to high oxygen level (1020 cm−3) detected by SIMS and processing at ∼ 600 °C. Increasing of the total carrier density due to the oxygen donor may cause the transport mechanism change from pure thermionic emission to thermionic-field emission. Reducing oxygen in the Si film by filtering the sputtering gas to 50 ppb oxygen level was proven to be effective. C-V results gave ∼1016 cm−3 level of carrier density after using oxygen filtering. P-N junction solar cells were made by B-ion implantation into n-type Si film and dopant activation at 700 °C. I-V-T study showed similar curves for P-N junction as for Schottky junction devices. This implies that the current transport was dominated by the Si films instead of the junctions for both Schottky and P-N junction devices.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 836: Symposium L – Materials for Photovoltaics , 2004 , L5.47
Copyright
Copyright © Materials Research Society 2005

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1. Guliants, E. and Anderson, W. A., J. Appl. Phys., 87, 3532 Google Scholar
2. Guliants, E. A. and Anderson, Wayne A., J. Appl. Phys. 89, 4648 Google Scholar
3. Ji, Chunhai and Anderson, Wayne A., IEEE Electron Devices, v 50, No. 9, September 2003.Google Scholar
4. Ji, Chunhai and Anderson, Wayne A., Solar Energy Materials and Solar Cells, In Press, Corrected Proof, Available online 16 June 2004 Google Scholar
5. Ji, Chunhai and Anderson, W. A., Mater. Res. Soc. Symp. Proc. 808, A4.21 San Francisco, CA, 2004 Google Scholar
6. Ditizion, R.A., Fonash, S.J. and Hseih, B.C., J. Vac. Sci. Tech. A. 10, 1, 59, 1992.Google Scholar
7. Nickel, N.H., Johnson, N.M. and Jackson, W.B., Appl. Phys. Lett., 62, 25, 3266, 1993.Google Scholar
8. Cielazyk, E.S., Kirmse, K.H.R., Stewart, R.A. and Wendt, A.E., Appl. Phys. Lett., 67, 21, 3099, 1995 Google Scholar
9. Ditizion, R.A., Fonash, S.J., Hseih, B.C., and Greve, D.W., Appl. Phys. Lett., 56, 12, 1140, 1990 Google Scholar
10. Nasuno, Y., Kondo, M., Matsuda, A., Appl. Phys. Lett. 78, 2330, 2001.Google Scholar
11. Komoda, M., Kamesaki, K., Masuda, A., Matsumura, H., Thin Solid Films 395, 198, 2001.Google Scholar
12. Kamei, T., Wada, T., Matsuda, A., Mater. Res. Soc. Symp. Proc. 664, A10.1.1. 2001 Google Scholar