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Cracking and Debonding in Integrated Microstructures

Published online by Cambridge University Press:  10 February 2011

X.H. Liu ,
Z. Suo ,
Q. Ma  and
H. Fujimoto
X.H. Liu
Affiliation:
Mechanical and Aerospace Engineering & Princeton Materials Institute, Princeton University, Princeton, NJ 08544
Z. Suo
Affiliation:
Mechanical and Aerospace Engineering & Princeton Materials Institute, Princeton University, Princeton, NJ 08544
Q. Ma
Affiliation:
Components Research, Intel Corporation, Santa Clara, CA 95052
H. Fujimoto
Affiliation:
Components Research, Intel Corporation, Santa Clara, CA 95052
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Abstract

Internal stresses inevitably arise in integrated microstructures. This paper reviews a fracture mechanics approach to devising design rules to avert cracking. The smallness of the feature size permits a strategy different from that conventionally used to analyze the fracture of bulk materials. In an integrated microstructure, high tensile stress is localized in small regions. The elastic energy stored in each region scales with its volume. The surface energy associated with the creation of a crack scales with the surface area of the crack. Thermodynamics dictates that a flaw cannot grow if the stored elastic energy is lower than the created surface energy. Consequently, for a sufficiently small feature size, the volume-to-area ratio is small, and no flaw can grow. Our design rules do not depend on flaw size. They are deterministic, and rely on well-specified geometric and physical parameters. Furthermore, the stress singularity at corners does not cause any particular difficulty. As an example, the thermal misfit cracking in a multilevel interconnect test structure is investigated.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 516: Symposium E – Low Dielectric Constant Materials IV , January 1998 , 313
Copyright
Copyright © Materials Research Society 1998

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References

1. Lee, J., Ma, Q., Marieb, T., Mack, A.S., Fujimoto, H., Flinn, P., Woolery, B., Keys, L., “Measurement and modeling of intrinsic stresses in CVDW lines”, in Materials Reliability in Microelectronics V, MRS Proceedings, Vol. 391, (1995).Google Scholar
2. Ma, Q., Lee, J. and Fujimoto, H., “Probing Stresses in Metal Trenches Using Raman Piezospectroscopy” EEP-Vol. 19-1, in Advances in Electronic Packaging, ASME (1997).Google Scholar
3. Greenebaum, B., Sauter, A.I., Flinn, P.A., and Nix, W.D., Appl. Phys. Lett. 58, p. 1,845 (1991).10.1063/1.105075Google Scholar
4. Shen, Y.L., Suresh, S., Blech, I.A., J. Appl. Phys. 80, p.1, 388 (1996).10.1063/1.362938Google Scholar
5. Blech, I.A., J. Appl. Phys. 47, p.1,203 (1976).10.1063/1.322842Google Scholar
6. Korhonen, M.A., Borgesen, P., Tu, K.N., Li, C.Y., J. Appl. Phys. 73, p.3,790 (1993).10.1063/1.354073Google Scholar
7. Suo, Z., “Stable state of interconnect under temperature change and electric current”, Acta Materialia, in press.Google Scholar
8. Ma, Q., Chiras, S., Clarke, D.R., and Suo, Z., J. Appl. Phys. 78, 1614 (1995).10.1063/1.360255Google Scholar
9. Bagchi, A., Lucas, G.E., Suo, Z. and Evans, A.G., J. Mater. Res. 9, p. 1,734 (1994).10.1557/JMR.1994.1734Google Scholar
10. Ma, Q., Bumgarner, J., Fujimoto, H., Lane, M., and Dauskardt, R., “Adhesion Measurement of Interfaces in Multilayer Interconnect Structures,” in Materials Reliability in Microelectronics VII, MRS Proceedings, Vol. 473, (1997).Google Scholar
11. Ma, Q., Xie, J., Chao, S., El-Mansy, S., McFadden, R., and Fujimoto, H., “Channeling cracking technique for toughness measurement of brittle dielectric thin films on silicon substrates”, in Materials Reliability in Microelectronics VIII, MRS Proceedings, (1998).Google Scholar
12. Lange, F.F., Fracture Mechanics of Ceramics, Vol. 2, p.599. Plenum, New York, (1976).Google Scholar
13. Lu, T.C., Yang, J., Suo, Z., Evans, A.G., Hecht, R., and Mehrabian, R., Acta Metall. Matter, 39, p.1, 883 (1991).Google Scholar
14. Hutchinson, J.W. and Suo, Z., Advances in Applied Mechanics, 29, p.64 (1991).Google Scholar
15. Ho, S. and Suo, Z., Acta Metall. Matter, 40, p. 1,685 (1992).10.1016/0956-7151(92)90111-QGoogle Scholar
16. Evans, A.G. and Hutchinson, J.W., Acta Materialia, 43, p. 2,507 (1995).10.1016/0956-7151(94)00444-MGoogle Scholar