Hostname: page-component-586b7cd67f-vdxz6 Total loading time: 0 Render date: 2024-11-24T15:01:02.408Z Has data issue: false hasContentIssue false

Conductivity and Microstructure of Inkjet-Printed Silver Tracks Depending on the Digital Pattern, Sintering Process, Substrate and Ink

Published online by Cambridge University Press:  07 January 2014

Dana Weise
Affiliation:
Chemnitz University of Technology, Chemnitz, Germany
Andrea Grimm
Affiliation:
Chemnitz University of Technology, Chemnitz, Germany
Uwe Weiß
Affiliation:
Chemnitz University of Technology, Chemnitz, Germany
Kalyan Yoti Mitra
Affiliation:
Chemnitz University of Technology, Chemnitz, Germany
Enrico Sowade
Affiliation:
Chemnitz University of Technology, Chemnitz, Germany
Reinhard R. Baumann
Affiliation:
Chemnitz University of Technology, Chemnitz, Germany Fraunhofer Institute for Electronic Nano Systems ENAS, Chemnitz, Germany
Get access

Abstract

Silver nanoparticle inks are increasingly applied for the manufacture of inkjet-printed electrically conductive patterns. In order to obtain high conductivity, the printed liquid patterns have to be functionalized by an appropriate post- treatment step. Modern post-treatment methods using e.g. microwaves, intense pulsed light or adopted infrared radiation, are nevertheless the basis of the thermal process. The thermal treatment e.g. in furnaces or on heating plates, is applicable for a great variety of inks and ensures an efficient sintering without major technical efforts. It has been studied intensively wherein the reports mainly focus on reduction of the resistivity by controlling the parameters of the thermal treatment. Our researches exceed these comparative studies by investigating multi-layered patterns, their manufacturing and post-treatment.

Two silver nanoparticle inks were inkjet printed on a rigid and a flexible substrate. The geometry of the patterns was varied. The different drying behaviors of the inks were investigated. In addition, the number of layers which were printed on top of each other was varied. The sintering temperatures and time durations were varied.

The morphology of the patterns is investigated by profilometry and optical microscopy. The microstructure is analyzed by scanning electron microscope and X-ray diffraction. Furthermore, the electrical characteristics were determined by the measurement of the resistance. The results indicate the relation between the manufacture and the resulting microstructure and functionality of the patterns. The knowledge of these parameters enables us to control the industrial manufacturing of similar conductive patterns.

Type
Articles
Copyright
Copyright © Materials Research Society 2014 

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

Kang, S. J. L.. Sintering Densification, Grain Growth & Microstructure. 1. Auflage. Oxford: Elsevier, Butterworth Heinemann, 2005.Google Scholar
Marjanovic, N., Hammerschmidt, J., Perelaer, J., Farnsworth, S., Rawson, I., Kus, M., Yenel, E., Tilki, S., Schubert, U. S. and Baumann, R. R., J. Mater. Chem. 21, 13634 (2011).10.1039/c1jm11237fCrossRefGoogle Scholar
Perelaer, J., Jani, R., Grouchko, M., Kamyshny, A., Magdassi, S., Schubert, U. S., Adv. Mater. 24(29), 3993 (2012).10.1002/adma.201200899CrossRefGoogle Scholar
Reinhold, I., Hendriks, C. E., Eckardt, R., Kranenburg, J. M., Perelaer, J., Baumann, R. R. and Schubert, U. S., J. Mater. Chem. 19, 3384 (2009).10.1039/b823329bCrossRefGoogle Scholar
Klauk, H., Organic Electronics, Materials, Manufacturing and Applications, WILEY-VCH, 2006.10.1002/3527608753CrossRefGoogle Scholar
Singh, M., Haverinen, H. M., Dhagat, P., Jabbour, G. E., Adv. Mater. 22(6), 673 (2010).10.1002/adma.200901141CrossRefGoogle Scholar
Chung, S., Jeong, J., Kim, D., Park, Y., Lee, C., Hong, Y., J. Disp. Technol. 8(1), 48 (2012).10.1109/JDT.2011.2174963CrossRefGoogle Scholar
Ortego, I., Sanchez, N., Garcia, J., Casado, F., Valderas, D., and Sancho, J. I., Int. J. Antennas Prop. 2012, (2012).Google Scholar
Bidoki, S. M., Nouri, J. and Heidari, A. A., J. Micromech. Microeng. 20(5), (2010).10.1088/0960-1317/20/5/055023CrossRefGoogle Scholar
Hon, K. K. B., Li, L., Hutchings, I. M., CIRP Annals-Manufacturing Technology 57(2), 601 (2008).10.1016/j.cirp.2008.09.006CrossRefGoogle Scholar
Perelaer, J., de Laat, A. W. M., Hendriks, C. E. and Schubert, U. S., J. Mater. Chem. 18(27), 3209 (2008).10.1039/b720032cCrossRefGoogle Scholar
Perelaer, J., Hendriks, C. E., , A. W. M. and Schubert, U. S. S., Nanotechnology 20(16), 165303 (2009).10.1088/0957-4484/20/16/165303CrossRefGoogle Scholar
Yang, X., He, W., Wang, S., Zhou, G., Tang, Y., Yang, J., J. Mater. Sci. Mater. Electron, 23(11), 1980 (2012).10.1007/s10854-012-0691-zCrossRefGoogle Scholar