Published online by Cambridge University Press: 10 February 2011
Using a fast ramp response technique, the high field characteristics, specifically the breakdown strength, of thermally grown silicon-dioxide (SiO2) and MOCVD grown aluminum-nitride (AIN), on n-type 6H-SiC epilayers is obtained as a function of three different processing conditions for the insulator growth. Significant improvement in the breakdown strength of thermally grown SiO2 after a 30 minute post annealing at 400°C in nitrogen ambient is reported. Further, the influence of temperature profile during the AIN growth on the breakdown strength is reported.