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Commercial MEMS Case Studies: The Impact of Materials, Processes and Designs

Published online by Cambridge University Press:  01 February 2011

Jack Martin
Jack Martin*
Affiliation:
[email protected]@comcast.net, United States
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Abstract

Minimizing risk is an important factor in new product planning because high volume breakthrough products require tens of millions of dollars to develop and bring to market. Sometimes risk can be minimized by following the IC model: build new devices on an existing process – just change the mask set. This approach obviously has limits. Adoption of new materials and processes greatly expands the horizon for “disruptive” products. This paper uses a case study approach to examine how changes in masks, materials and unit processes were used, and will continue to be used, to produce MEMS products for high volume applications.

Keywords

microelectro-mechanical (MEMS)sensorsurface chemistry
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 1139: Symposium GG – Microelectromechanical Systems–Materials and Devices II , 2008 , 1139-GG01-01
Copyright
Copyright © Materials Research Society 2009

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References

REFERENCES

1. Angell, J. B., Terry, S. C., and Barth, P. W., Scientific American, 248 (4), 44 (1983).Google Scholar
2. Majumder, S., Lampen, J., Morrison, R. and Maciel, J., Microwave Symp. Digest, 3, 1935–1938 (2003).Google Scholar
3. Lindenberger, W. S., Poteat, T. L., and West, J. E., U.S.Patent No. 4 524 247 (18 June 1985).Google Scholar
4. Baumhauer, J. C., Hershey, H. J., and Poteat, T. L., U. S.Patent No. 4 533 795 (6 August 1985).Google Scholar
5. Busch-Vishniac, I. J., Lindenberger, W. S., Lynch, W. T., and Poteat, T. O., U. S.Patent No. 4 558 184 (10 December 1985).Google Scholar
6. Anon, Micronews, 53, (Yole Développement SARL, Lyon, December 2006) p. 9.Google Scholar
7. Martin, J. R., U.S.Patent No. 6 358 771 (19 March 2002).Google Scholar
8. Potin, M., Micronews, 68, (Yole Développement SARL, Lyon, April 2008) pp. 6–7.Google Scholar
9. Martin, J., Proc. SPIE, 6463, Reliability, Packaging, Testing and Characterization of MEMS/MOEMS VI, edited by Hartzell, A. and Ramesham, R. (SPIE, Bellingham, 2007) p. 64630M.Google Scholar
10. Yun, C. H., Martin, J. R., Chen, L. and Frey, T. J., ECS Transactions, 16 (8), 117–124 (2008).Google Scholar
11. Martin, J. R. in Nanotribology: Critical Assessment and Research Needs, edited by Hsu, S. M. and Ying, Z. C. (Kluwer, Dordrecht, 2002) ch. 14.Google Scholar
12. Martin, J. R. in Handbook of NAnotechnology (2nd ed), edited by Bhushan, B. (Springer-Verlag, Berlin, 2007) ch. 55.Google Scholar
13. Martin, J. R., U.S.Patent No. 7 364 942 (29 April 2008).Google Scholar