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CMOS Circuits on Silicon Carbide for High Temperature Operation

Published online by Cambridge University Press:  17 June 2014

David T. Clark ,
Robin F. Thompson ,
Aled E. Murphy ,
David A. Smith ,
Ewan P. Ramsay ,
Robert A. R. Young ,
Craig T. Ryan ,
Sean Wright  and
Alton B. Horsfall
David T. Clark
Affiliation:
Semiconductor Business, Raytheon UK, Glenrothes, KY7 5PY, U.K.
Robin F. Thompson
Affiliation:
Semiconductor Business, Raytheon UK, Glenrothes, KY7 5PY, U.K.
Aled E. Murphy
Affiliation:
Semiconductor Business, Raytheon UK, Glenrothes, KY7 5PY, U.K.
David A. Smith
Affiliation:
Semiconductor Business, Raytheon UK, Glenrothes, KY7 5PY, U.K.
Ewan P. Ramsay
Affiliation:
Semiconductor Business, Raytheon UK, Glenrothes, KY7 5PY, U.K.
Robert A. R. Young
Affiliation:
Semiconductor Business, Raytheon UK, Glenrothes, KY7 5PY, U.K.
Craig T. Ryan
Affiliation:
Semiconductor Business, Raytheon UK, Glenrothes, KY7 5PY, U.K.
Sean Wright
Affiliation:
Semiconductor Business, Raytheon UK, Glenrothes, KY7 5PY, U.K.
Alton B. Horsfall
Affiliation:
School of Electrical & Electronic Engineering, Newcastle University, NE1 7RU, U.K.
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Abstract

We present the characteristics of a high temperature CMOS integrated circuit process based on 4H silicon carbide designed to operate at temperatures beyond 300°C. N-channel and P-channel transistor characteristics at room and elevated temperatures are presented. Both channel types show the expected low values of field effect mobility well known in SiC MOSFETS. However the performance achieved is easily capable of exploitation in CMOS digital logic circuits and certain analogue circuits, over a wide temperature range.

Data is also presented for the performance of digital logic demonstrator circuits, in particular a 4 to 1 analogue multiplexer and a configurable timer operating over a wide temperature range. Devices are packaged in high temperature ceramic dual in line (DIL) packages, which are capable of greater than 300°C operation. A high temperature “micro-oven” system has been designed and built to enable testing and stressing of units assembled in these package types. This system heats a group of devices together to temperatures of up to 300°C while keeping the electrical connections at much lower temperatures. In addition, long term reliability data for some structures such as contact chains to n-type and p-type SiC and simple logic circuits is summarized.

Keywords

microelectronicselectrical propertiesdevices
Type
Articles
Information
MRS Online Proceedings Library (OPL) , Volume 1693: Symposium DD – Silicon Carbide–Materials, Processing and Devices , 2014 , mrss14-1693-dd03-05
Copyright
Copyright © Materials Research Society 2014 

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References

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