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Characterization of Textured Aluminum Lines and Modelling of Stress Voiding

Published online by Cambridge University Press:  15 February 2011

S.C. Wardle ,
B.L. Adams ,
C.S. Nichols  and
D.A. Smith
S.C. Wardle
Affiliation:
Department of Mechanical Engineering, Yale University, Newhaven, CT, 06520,
B.L. Adams
Affiliation:
Department of Mechanical Engineering, Brigham Young University, Provo, UT84602,
C.S. Nichols
Affiliation:
Department of Materials Science and Engineering, Cornell University, Ithaca, NY 14853 and
D.A. Smith
Affiliation:
Smith, Department of Materials Engineering, Stevens Institute of Technology, Hoboken, NJ 07030.
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Abstract

It is well known from studies of individual interfaces that grain boundaries exhibit a spectrum of properties because their structure is misorientation dependent. Usually this variability is neglected and properties are modeled using a mean field approach. The limitations inherent in this approach can be overcome, in principle, using a combination of experimental techniques, theory and modeling. The bamboo structure of an interconnect is a particularly simple polycrystalline structure that can now be readily characterized experimentally and modeled in the computer. The grain misorientations in a [111] textured aluminum line have been measured using the new automated technique of orientational imaging microscopy. By relating boundary angle to diffusivity the expected stress voiding failure processes can be predicted through the link between misorientation angle, grain boundary excess free energy and diffusivity. Consequently it can be shown that the high energy boundaries are the favored failure sites thermodynamically and kinetically.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 343: Symposium H – Polycrystalline Thin Films - Structure, Texture, Properties and Applications , 1994 , 665
Copyright
Copyright © Materials Research Society 1994

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References

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