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Characterization of Oxide Layers of Bulk Si1-xGex

Published online by Cambridge University Press:  21 March 2011

W. Suzukake
Affiliation:
Department of Materials Science and Technology, Science University of Tokyo, 2641 Yamazaki, Noda-City, Chiba 278-8510, Japan
S. Nemoto
Affiliation:
Department of Materials Science and Technology, Science University of Tokyo, 2641 Yamazaki, Noda-City, Chiba 278-8510, Japan
T. Iida
Affiliation:
Department of Materials Science and Technology, Science University of Tokyo, 2641 Yamazaki, Noda-City, Chiba 278-8510, Japan
Y. Takanashi
Affiliation:
Department of Materials Science and Technology, Science University of Tokyo, 2641 Yamazaki, Noda-City, Chiba 278-8510, Japan
S. Sakuragi
Affiliation:
Union Material Inc., 1640 Oshido-jyoudai, Tone-Machi, Kitasouma, Ibaraki 300-1602, Japan
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Abstract

Bulk crystals of Si0.4Ge0.6, grown using the vertical Bridgman method, were oxidized at 800 °C for 1 h using oxygen in dry oxidation and a stream of de-ionized water in wet oxidation. Single-like and polycrystalline Si0.4Ge0.6samples were used. The oxidized samples were analyzed using x-ray photoelectron spectroscopy to determine the chemical states of the Si and Ge in the oxide. In the sample oxidized using a dry ambient, the oxide layer consisted mainly of SiO2, and GeO2 formed the subsurface area only. This can be accounted for by the differences in the formation of the free energies of the SiO2 and GeO2. In wet oxidation, the oxide layer had a mixed structure consisting of SiO2 and GeO2. To understand the oxide formation mechanisms in the wet oxidation process, an introduction of a chemical bond manipulation explained the formation of the mixed structure.

Type
Research Article
Copyright
Copyright © Materials Research Society 2001

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