Hostname: page-component-78c5997874-8bhkd Total loading time: 0 Render date: 2024-11-08T00:30:40.088Z Has data issue: false hasContentIssue false

Characterization of MOS Devices Fabricated on Carbon Implanted Silicon Substrates

Published online by Cambridge University Press:  26 February 2011

Ibrahim Ban
Affiliation:
Department of Electrical and Computer Engineering, North Carolina State University, P.O. Box 7911, Raleigh, NC 27695–7911, USA
Mehmet C. Öztürk
Affiliation:
Department of Electrical and Computer Engineering, North Carolina State University, P.O. Box 7911, Raleigh, NC 27695–7911, USA
Kim Christensen
Affiliation:
Department of Materials Science and Engineering, North Carolina State University, P.O. Box 7907, Raleigh, NC 27695–7907, USA
Dennis M. Maher
Affiliation:
Department of Materials Science and Engineering, North Carolina State University, P.O. Box 7907, Raleigh, NC 27695–7907, USA
Get access

Abstract

In this study, we present characterization of Metal-Oxide-Semiconductor (MOS) capacitors fabricated on carbon (C14) implanted silicon substrates. Carbon was implanted at an energy of 50 keV with doses ranging from 1 × 1012 cm−2 to 4.1×1015 cm−2. Metal-Oxide-Silicon (MOS) capacitors were fabricated and used to determine the MOS capacitance-voltage (C-V) and capacitance-time (C-t) behavior. These measurements revealed a strong correlation between carrier lifetime and the carbon dose. Degradation in lifetime was observed for carbon dose levels as low as 4 × l012 cm−2. At carbon doses equal to and above 6.4 × l013 cm−2, extremely low generation lifetimes were obtained (∼ 10−7 sec). On the other hand, degradation in C-V characteristics was observed only for carbon doses above 2.7 × l014 cm−2. Below this dose, both flatband voltage and interface trap density of the carbon implanted samples were comparable to those of the monitors. Analysis of the samples by cross sectional transmission electron microscopy revealed the absence of extended defects even in samples with high carbon dose levels.

Type
Research Article
Copyright
Copyright © Materials Research Society 1995

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1. Beck, R. B., Brozek, T., Ruzyllo, J., and Hossain, S. D., J. Elect. Mat. 22, 689 (1993).Google Scholar
2. Kolbesen, B. O., in Aggregation Phenomena of Point Defects in Silicon, edited by Sirtl, E., and Goorissen, J. (The Electrochemical Society, Princeton, NJ, 1983), pp. 155175.Google Scholar
3. Kolbesen, B. O. and Muhlbauer, A., Sol. St. Elect. 25, 759 (1982).Google Scholar
4. Akiyama, N., Yatsurugi, Y., Endo, Y., and Imayoshi, Z., Appl. Phys. Lett. 22, 630 (1973).Google Scholar
5. Zulehner, W., in Aggregation Phenomena of Point Defects in Silicon, edited by Sirtl, E., and Goorissen, J. (The Electrochemical Society, Princeton, NJ, 1983).Google Scholar
6. Feng, S. Q., Kalejs, J. P., and Ast, D. G. in Oxygen, carbon, hydrogen, and nitrogen in crystalline silicon, edited by Mikkelsen, J. C. (Mat. Res. Soc. Symp. Proc. 59, Pittsburg, PA, 1986) pp. 439444.Google Scholar
7. Shimura, F., J. Appl. Phys. 59, 3251 (1986).Google Scholar
8. Nishikawa, S. and Yamaji, T., Extended Abstracts of the 1992 International Conference on Solid State Devices and Materials , 26–28 (1992).Google Scholar
9. Wong, H., Cheung, N. W., Chu, P. K., Liu, J., and Mayer, J. W., Appl. Phys. Lett. 52, 1023 (1988).Google Scholar
10. Wong, H., Cheung, N. W., and Wong, S. S., Nucl. Inst. Meth. Phys. B37/38, 970 (1989).Google Scholar
11. Awadelkarim, O. O., Suliman, B. A., Monemar, B., Lindstrom, J. L., Zhang, Y., Corbett, J. W., J. Appl. Phys. 67, 270 (1990).Google Scholar
12. Kang, J. S., Schroder, D. K., Phys. Stat. Sol. (a) 89, 13 (1985).Google Scholar
13. Schroder, D. K., Semiconductor Material and Device Characterization (Wiley-Interscience, New York, 1990).Google Scholar