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Characterisation of the mechanical properties of MEMS devices using nanoscale techniques

Published online by Cambridge University Press:  11 February 2011

Nicholas X. Randall  and
Richard A. J. Soden
Nicholas X. Randall
Affiliation:
CSM Instruments Inc., 197 First Avenue, Needham MA 02494, USA
Richard A. J. Soden
Affiliation:
CSM Instruments Inc., 197 First Avenue, Needham MA 02494, USA
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Abstract

This paper focuses on recent developments in the localised characterisation of the mechanical properties of Microsystems and MEMS devices and structures. Conventional indentation techniques provide a highly powerful method for measuring the load and depth response of bulk and coated materials, but can also be used to measure the mechanical properties of very small micro-machined silicon structures. Beam structures, such as are used for accelerometers, need to be characterised in terms of the number of cycles to failure, the spring constant or the energy required to bend the beam by a required amount. Such localised testing needs to be adapted to work at various distances from the origin of the beam with a positioning accuracy of less than a micron. Initial studies have proved to be highly repeatable. A range of examples is presented which covers a range of application areas, including accelerometer beam structures, microswitches and printer head structures. The basic instrumental concepts are explained together with the modifications required for testing small structures in a localised way.

Keywords

MEMSmechanical propertiesindentationscratchaccelerometermicroswitchprinter head
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 741: Symposium J – Nano- and Microelectromechanical Systems (NEMS and MEMS) and Molecular Machines , 2002 , J2.3
Copyright
Copyright © Materials Research Society 2003

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References

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