Published online by Cambridge University Press: 21 February 2011
The crucial problem for buried layer formation using MeV implantation is the reduction of anomalous leakage current at the phosphorus dose of lxl014/cm2. We have demonstrated that the origin of anomalous leakage current is dislocations, on {111}Si planes, elongated along the <110 direction and that these defects can be reduced by using a high ramping rate above 50°C /sec. At the low ramping rate below 10°C/sec, high leakage current above 1 nA was observed , which was caused by the extension of dislocations to the surface. On the other hand, by increasing the ramping rate above 50°C/sec, dislocations were formed around the Rp, but they did not extended to the surface and as a result, low leakage current was obtained. These results suggest that some kinds of defects can be suppressed by ramping rate.