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An in Situ Transmission Electron Microscopy Study During NH3 Ambient Annealing of Cu-Cr Thin Films

Published online by Cambridge University Press:  15 February 2011

Z. Atzmon ,
R. Sharma ,
J.W. Mayer  and
S.Q. Hong
Z. Atzmon
Affiliation:
Center for Solid State Science, Arizona State University, Tempe, AZ 85287
R. Sharma
Affiliation:
Center for Solid State Science, Arizona State University, Tempe, AZ 85287
J.W. Mayer
Affiliation:
Center for Solid State Science, Arizona State University, Tempe, AZ 85287
S.Q. Hong
Affiliation:
Dept. Mater. Sci. Eng., Cornell University, Ithaca, NY 14853
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Abstract

Nitridation of Cu-Cr alloy films under an NH3 ambient was studied using in situ transmission electron Microscopy. Cu-Cr thin films (40–100 nm) were deposited on a single crystal NaCl substrate by electron beam coevaporation, and were heat treated up to 750°C at 2.5–3.0 Torr NH3. The films were also vacuum (10-6 Torr) annealed under the same conditions for comparison. Initial observation of Cu and Cr crystallization occurred at 470°C for both environmental conditions. The nitridation process of Cr to form CrN was observed initially at 580°C and was followed by evolution of faceted Cu grain growth in the CrN Matrix.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 317: Symposium B – Mechanisms of Thin Film Evolution , 1993 , 245
Copyright
Copyright © Materials Research Society 1994

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References

REFERENCES

[1] P.Ho, S., in Principles of Electronic Packaging, edited by Seraphim, D. P., Lasky, R., and Li, C. Y. (McGraw-Hill, New York, 1989), p. 809.Google Scholar
[2] Li, J., Shacham-Diamand, Y., and Mayer, J. W., Materials Science Report 9, 1 (1992).Google Scholar
[3] McBrayer, J. D., Swanson, R. M., and Sigmon, T. W., J. Electrchem. Soc. 133, 1242 (1986).CrossRefGoogle Scholar
[4] Olowolafe, J. O., Li, J., and Mayer, J. W., J. Appl. Phys. 68, 6207 (1990).Google Scholar
[5] Li, J., Mayer, J. W., Shacham-Diamand, Y., and Colgan, E. G., Appl. Phys. Lett. 60, 2983 (1992).Google Scholar
[6] HoUoway, K., Fryer, P. M., Cabrai, C. Jr, Harper, J. M. E., Bailey, P. J., and Kelleher, K. H., J. Appl. Phys. 71, 5433 (1992).Google Scholar
[7] Dean, J. A., in: Lange's Handbook of Chemistry (McGraw-Hill, New York, 1973).Google Scholar
[8] Sharma, R., Atzmon, Z., Mayer, J. W., and Hong, S. Q., published in symposium B in this conference.Google Scholar
[9] Sharma, R., Atzmon, Z., and Mayer, J. W., to be presented at spring MRS (1994).Google Scholar