Hostname: page-component-78c5997874-g7gxr Total loading time: 0 Render date: 2024-11-08T00:06:43.500Z Has data issue: false hasContentIssue false
  • English
  • Français

An in Situ Transmission Electron Microscopy Study During NH3 Ambient Annealing of Cu-Cr Thin Films

Published online by Cambridge University Press:  15 February 2011

Z. Atzmon ,
R. Sharma ,
J.W. Mayer  and
S.Q. Hong
Z. Atzmon
Affiliation:
Center for Solid State Science, Arizona State University, Tempe, AZ 85287
R. Sharma
Affiliation:
Center for Solid State Science, Arizona State University, Tempe, AZ 85287
J.W. Mayer
Affiliation:
Center for Solid State Science, Arizona State University, Tempe, AZ 85287
S.Q. Hong
Affiliation:
Dept. Mater. Sci. Eng., Cornell University, Ithaca, NY 14853
Get access

Abstract

Nitridation of Cu-Cr alloy films under an NH3 ambient was studied using in situ transmission electron Microscopy. Cu-Cr thin films (40–100 nm) were deposited on a single crystal NaCl substrate by electron beam coevaporation, and were heat treated up to 750°C at 2.5–3.0 Torr NH3. The films were also vacuum (10-6 Torr) annealed under the same conditions for comparison. Initial observation of Cu and Cr crystallization occurred at 470°C for both environmental conditions. The nitridation process of Cr to form CrN was observed initially at 580°C and was followed by evolution of faceted Cu grain growth in the CrN Matrix.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 317: Symposium B – Mechanisms of Thin Film Evolution , 1993 , 245
Copyright
Copyright © Materials Research Society 1994

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

[1] P.Ho, S., in Principles of Electronic Packaging, edited by Seraphim, D. P., Lasky, R., and Li, C. Y. (McGraw-Hill, New York, 1989), p. 809.Google Scholar
[2] Li, J., Shacham-Diamand, Y., and Mayer, J. W., Materials Science Report 9, 1 (1992).Google Scholar
[3] McBrayer, J. D., Swanson, R. M., and Sigmon, T. W., J. Electrchem. Soc. 133, 1242 (1986).CrossRefGoogle Scholar
[4] Olowolafe, J. O., Li, J., and Mayer, J. W., J. Appl. Phys. 68, 6207 (1990).Google Scholar
[5] Li, J., Mayer, J. W., Shacham-Diamand, Y., and Colgan, E. G., Appl. Phys. Lett. 60, 2983 (1992).Google Scholar
[6] HoUoway, K., Fryer, P. M., Cabrai, C. Jr, Harper, J. M. E., Bailey, P. J., and Kelleher, K. H., J. Appl. Phys. 71, 5433 (1992).Google Scholar
[7] Dean, J. A., in: Lange's Handbook of Chemistry (McGraw-Hill, New York, 1973).Google Scholar
[8] Sharma, R., Atzmon, Z., Mayer, J. W., and Hong, S. Q., published in symposium B in this conference.Google Scholar
[9] Sharma, R., Atzmon, Z., and Mayer, J. W., to be presented at spring MRS (1994).Google Scholar