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Al2O3 as a Transition Layer for GaN and InGaN Growth on ZnO by MOCVD

Published online by Cambridge University Press:  31 January 2011

Nola Li
Affiliation:
[email protected], Georgia Institute of Technology, Atlanta, United States
Shen-Jie Wang
Affiliation:
[email protected], Georgia Institute of Technology, Atlanta, United States
William E. Fenwick
Affiliation:
[email protected], Georgia Institute of Technology, Atlanta, United States
Andrew Melton
Affiliation:
[email protected], Georgia Institute of Technology, Atlanta, United States
Chung-Lung Huang
Affiliation:
[email protected], National Taiwan University, Taipei, United States
Zhe Chuan Feng
Affiliation:
[email protected], National Taiwan University, Taipei, United States
Christopher Summers
Affiliation:
[email protected], Georgia Institute of Technology, Atlanta, United States
Muhammad Jamil
Affiliation:
[email protected], Georgia Institute of Technology, Atlanta, United States
Ian Ferguson
Affiliation:
[email protected], University of North Carolina Charlotte, Charlotte, United States
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Abstract

GaN and InGaN layers were grown on annealed 20 and 50nm Al2O3/ZnO substrates by metalorganic chemical vapor deposition (MOCVD). GaN was only observed by high resolution x-ray diffraction (HRXRD) on 20 nm Al2O3/ZnO substrates. Room temperature photoluminescence (RT-PL) showed the red shift of the GaN near band-edge emission, which might be from oxygen incorporation forming a shallow donor-related level in GaN. HRXRD measurements revealed that (0002) InGaN layers were also successfully grown on 20nm Al2O3/ZnO substrates. In addition, thick InGaN layers (∼200-300nm) were successfully grown on Al2O3/ZnO and bare ZnO substrates. These results are significant as previous studies showed decomposition of the layer at InGaN thicknesses of 100nm or less.

Type
Research Article
Copyright
Copyright © Materials Research Society 2010

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