Hostname: page-component-586b7cd67f-vdxz6 Total loading time: 0 Render date: 2024-11-24T21:00:33.215Z Has data issue: false hasContentIssue false
  • English
  • Français

Adhesive Bonding Via Exposure to Microwave Radiation and Resulting Mechanical Evaluation

Published online by Cambridge University Press:  10 February 2011

Felix L. Paulauskas ,
Thomas T. Meek  and
C. David Warren
Felix L. Paulauskas
Affiliation:
Oak Ridge National Laboratory, Engineering Technology Division Oak Ridge, TN 37831–8048
Thomas T. Meek
Affiliation:
University of Tennessee, Materials Science and Engineering Department Knoxville, TN 37996–2200
C. David Warren
Affiliation:
Oak Ridge National Laboratory, Engineering Technology Division Oak Ridge, TN 37831–8048
Get access

Abstract

Adhesive bonding/joining through microwave radiation curing has been evaluated as an alternative processing technology. This technique significantly reduces the required curing time for the adhesive while maintaining equivalent physical characteristics as the adhesive material is polymerized (crosslinked). This results in an improvement in the economics of the process. Testing of samples cured via microwave radiation for evaluation of mechanical properties indicated that the obtained values from the single lap-shear test are in the range of the conventionally cured samples. In general, the ultimate tensile strength, OB, for the microwave processed samples subjected to this single lap-shear test was slightly higher than for conventionally cured samples. This technology shows promise for being applicable to a wide range of high volume, consumer goods industries, where plastics and polymer composites will be processed.

Keywords

Composite BondingAdhesivesMicrowave ProcessingSingle Lap-Shear Test
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 430: Symposium O – Microwave Processing of Materials V , 1996 , 193
Copyright
Copyright © Materials Research Society 1996

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1. Paulauskas, F. L., Meek, T. T., Warren, C. D., SAMPE International Technical Conference Proceedings, 27, 114 (1995).Google Scholar
2. Meek, T. T., J. of Materials Science Letters, 6, 638 (1987).Google Scholar