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Adhesion Strength and Microstructure of Cu/Ni/OsOx/glass Structure for Highly-Reliable Cu Interconnection

Published online by Cambridge University Press:  03 July 2013

Mitsuhiro Watanabe  and
Eiichi Kondoh
Mitsuhiro Watanabe
Affiliation:
Interdisciplinary Graduate School of Medicine and Engineering, University of Yamanashi, 4-3-11 Takeda, Kofu, Yamanashi, 4008511, Japan
Eiichi Kondoh
Affiliation:
Interdisciplinary Graduate School of Medicine and Engineering, University of Yamanashi, 4-3-11 Takeda, Kofu, Yamanashi, 4008511, Japan
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Abstract

This study demonstrates that thin metallic oxide layers, such as OsOx and ZnO, function as a strong adhesion layer between Cu film and glass substrate. The adhesion strength was studied with a micro-scratch tester and the films and interfaces were characterized by energydispersive X-ray spectrometry. The presence of an extremely thin intermixing layer was confirmed at the metal/glass interfaces. The formation of such an interfacial layer increased the adhesion strength significantly.

Keywords

Cuadhesionelectronic material
Type
Articles
Information
MRS Online Proceedings Library (OPL) , Volume 1559: Symposium AA – Advanced Interconnects for Micro- and Nanoelectronics—Materials, Processes and Reliability , 2013 , mrss13-1559-aa08-03
Copyright
Copyright © Materials Research Society 2013 

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References

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