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Adhesion of Screen Printed Conductors on Laser Reduced AlN

Published online by Cambridge University Press:  21 February 2011

S. Gopalakrishnan  and
Janet K. Lumpp
S. Gopalakrishnan
Affiliation:
University of Kentucky, Electrical Engineering Department, Lexington, KY
Janet K. Lumpp
Affiliation:
University of Kentucky, Electrical Engineering Department, Lexington, KY
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Abstract

Aluminum Nitride (AlN) has not attained the type of success alumina has had with thick film materials. This project is aimed at increasing the number of thick film inks compatible with AIN. Excimer laser reduced AIN is metallic, but not sufficiently conductive to act as an interconnection for microelectronic circuits. The reduced surface acts as a bonding layer to promote adhesion of screen printed metal films.

Design of Experiments (DOE) plays a critical role in determining the success of a research project. Completely Randomized Nested Classification design strategy is used in these experiments. The Ag-Pd ink formulated for alumina is screen printed on AIN and alumina substrates in a random order and fired. Wires are soldered to the pads and a pull test is done. Analysis of Variance (ANOVA) is used to compare the adhesion strength of Ag-Pd ink formulated for alumina screen printed on Al2O3 and laser reduced AIN substrates.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 390: Symposium S – Electronic Packaging Materials Science VIII , 1995 , 263
Copyright
Copyright © Materials Research Society 1995

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References

REFERENCES

1. Pelletier, J., Gervais, D., Pomot, C., “Applications of widegap semiconductors to surface ionization; Work functions of AIN and SiC single crystals”; J. Appl. Phys., 55 4].Google Scholar
2. Yamaguchi, Takashi, Kageyama, Makiko, “Oxidation Behavior of AIN in the Prescence of Oxide and Glass for Thick Film Applications”, IEEE Trans. Comp. Hybrids Manuf. Technol. 12 3] 402–5 (1989).Google Scholar
3. Cochran, and Cox, , Design of Experiments, 2nd ed. (John Wiley and Sons Inc., New York,1992), pp. 95–106.Google Scholar
4. DuPont Electronics, Test Method for Wire Peel Adhesion of Soldered Thick Film Conductors to Ceramic Substrates (Technical Bulletin).Google Scholar