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Void Evolution via Coupled Creep, Diffusion and Electromigration in Confined Nano-interconnects

Published online by Cambridge University Press:  26 February 2011

Dongchoul Kim  and
Wei Lu
Dongchoul Kim
Affiliation:
[email protected], University of Michigan, Mechanical Engineering, 2250 GGBrown Bldg, Ann Arbor, MI, 48109, United States
Wei Lu
Affiliation:
[email protected], University of Michigan, Mechanical Engineering, Ann Arbor, MI, 48109, United States
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Abstract

A three dimensional electromigration model is presented to account for void evolution in small scale interconnects. The model provides better understanding of the evolution process by considering concurrent kinetics of creep flow and surface diffusion. The multiple kinetics and energetics are incorporated into a diffusive interface model. Simulations show that a shape stable in surface diffusion can become unstable in a creep dominated process, which leads to a quite different void morphology.

Keywords

electromigrationdiffusionmetal
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 978: Symposium GG – Multiscale Modeling of Materials , 2006 , 0978-GG05-13
Copyright
Copyright © Materials Research Society 2007

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