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Using the Surface Potential Decay Method to probe electrical conduction in epoxy resins used for packaging

Published online by Cambridge University Press:  21 March 2011

Alain Sylvestre ,
Patrice Gonon ,
Jérôme Teysseyre  and
Christophe Prior
Alain Sylvestre
Affiliation:
Lab. for Electrostatics and Dielectric Materials, University of Grenoble, and French National Center for Scientific Research. LEMD-CNRS, BP166, 38042 Grenoble Cedex 9, France, (E-mail: [email protected])
Patrice Gonon
Affiliation:
Lab. for Electrostatics and Dielectric Materials, University of Grenoble, and French National Center for Scientific Research. LEMD-CNRS, BP166, 38042 Grenoble Cedex 9, France
Jérôme Teysseyre
Affiliation:
STMicroelectronics, Corporate Package development, BP217, 38019 Grenoble Cedex, France
Christophe Prior
Affiliation:
STMicroelectronics, Corporate Package development, BP217, 38019 Grenoble Cedex, France
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Abstract

In this work we discuss the usefulness of the Surface Potential Decay (SPD) method to investigate electrostatic charges deposited on epoxy resins which are used for electronic packaging. Corona discharges were applied on epoxy resins with different degrees of Post Mold Curing (PMC). SPD studies were conducted at room temperature under a relative humidity of about 45%. In the first part of this study we analyze the flow of electrostatic charges as a function of time. Using the SPD method we evidence that 10% of the electrical charge is still present at the surface three hours after the corona discharge has been applied. We find that the surface potential decay is more important for samples with longer PMC duration. In the second part of this work we provide a physical interpretation of the surface charge decay. We suggest that it is related to polarization mechanisms within the bulk of the material.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 682: Symposium N – Microelectronics and Microsystems Packaging , 2001 , N3.7
Copyright
Copyright © Materials Research Society 2001

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References

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