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Transition State Model for Grain Boundary Motion During Ion Bombardment

Published online by Cambridge University Press:  26 February 2011

Harry A. Atwater
Affiliation:
Massachusetts Institute of Technology, Cambridge, MA 02138
Carl V. Thompsonm
Affiliation:
Massachusetts Institute of Technology, Cambridge, MA 02138
Henry I. Smith
Affiliation:
Massachusetts Institute of Technology, Cambridge, MA 02138
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Abstract

Ion bombardment of polycrystalline Ge, Si, and Au films leads to rates of grain boundary motion that greatly exceed rates of thermally-induced motion at the same temperature and which exhibit a weak temperature dependence. The enhanced migration rate is proportional to the rate of energy deposition in nuclear collisions at or very near the grain boundary. Experimental work is reviewed, and a transition state model is presented which accounts for the observed kinetics of grain boundary migration during bombardment. This model suggests that the rate limiting step in grain boundary motion may be thermally-induced migration of a bombardment-generated defect across the boundary. Also, the ratio of atomic jumps at grain boundaries to the local collision-induced Frenkel defect generation rate is shown to be characteristic of each material, but independent of ion mass and ion flux. The model is extended to the motion of an interface between two phases, and applications to crystallization during ion bombardment are discussed.

Type
Research Article
Copyright
Copyright © Materials Research Society 1988

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References

REFERENCES

[1] Linnros, J., Svennson, B. and Holmen, G., Phys. Rev. B 30, 3629 (1984); J. Linnros, G. Holmen and B. Svennson, Phys. Rev. B32, 2770 (1985).Google Scholar
[2] Williams, J. S., Elliman, R. G., Brown, W. L. and Seidel, T. E., Phys. Rev. Lett., 55, 1482 (1985).Google Scholar
[3] Atwater, H. A., Smith, H. I. and Thompson, C. V., in Beam-Solid Interactions and Phase Transformations,edited by Kurz, H., Olson, G.L. and Poate, J.M. (Materials Research Society, Pittsburgh, PA, 1986), Vol 51, pp. 337342.Google Scholar
[4] Atwater, H.A., Thompson, C.V. and Smith, H.I., in Beam-Solid Interactions and Transient Processes, edited by Picraux, S.T., Thompson, M.O. and Williams, J.S.(Materials Research Society, Pittsburgh, PA, 1987), Vol.74, pp 499504.Google Scholar
[5] Wang, P., Thompson, D.A. and Smeltzer, W.W., Nucl. Instr. and Meth., B7/8, 97 (1986).Google Scholar
[6] Wang, P., Thompson, D.A. and Smeltzer, W.W., Nucl. Instr. and Meth., B16, 288 (1986).Google Scholar
[7] Atwater, H.A., Thompson, C.V. and Smith, H.I., submitted to J. Appl. Phys.Google Scholar
[8] Turnbull, D., Trans. AIME, 191, 661 (1951).Google Scholar
[9] Spaepen, F. and Turnbull, D., in Laser Annealing and Electron Beam Processing of Semiconductor Structures, edited by Poate, J.M. and Mayer, J.W.(Academic Press, New York, 1981), p. 15.Google Scholar
[10] Williams, J.S. and Elliman, R.G., Phys. Rev. Lett., 51, 1069 (1983).Google Scholar
[11] Van Wyk, G.N. and Smith, H.J., Nucl. Instrum. Methods 170, 433 (1980).Google Scholar
[12] Mayer, J.W. and Lau, S.S., in Surface Modification and Alloying by Laser, Ion and Electron, Poate, J.M., Foti, G., and Jacobson, D.C. eds., (Plenum Press, New York, 1983) p. 255.Google Scholar
[13] Liu, J.C. and Mayer, J.W., Nucl. Instr. and Meth., B19/20, 538 (1987).Google Scholar
[14] Liu, J.C., Nastasi, M. and Mayer, J.W., J. Appl.Phys., 62, 423 (1987).CrossRefGoogle Scholar
[15] Bolling, G.F. and Winegard, W.C., Acta Metall., 6, 283 (1958); P. Gordon and T.A. El-Bassyouni, Trans. A.I.M.E., 233, 391 (1965).Google Scholar
[16] Biersack, J. P. and Haggmark, L. G., Nucl. Instr. and Meth. 174, 257 (1980).Google Scholar
[17] Beck, P.A., Phil. Mag. Suppl. 3, 245 (1954); P.A. Beck, J.C. Demer, and M.L. Holzworth, Trans. Amer. Inst. Min. Met. Eng. 175, 372 (1948).Google Scholar
[18] Mullins, W.W., J. Appl. Phys., 28, 333 (1957).Google Scholar
[19] Hillert, M., Acta. Metall., 13, 227 (1965).CrossRefGoogle Scholar
[20] Van Vechten, J.A., Phys. Rev. B10, 1482 (1974).Google Scholar
[21] Watkins, G.D., in Radiation Damage in Semiconductors(Dunod, Paris, 1965), p. 97.; G.D. Watkins, J. Phys. Soc. Jap. 18, Suppl. II, 22 (1963).Google Scholar
[22] Hornstra, J., Physica, 25, 409 (1959); J.T. Wetzel, A.A. Levi and D.A. Smith, in Grain Boundary Structure and Related Phenomena, JIMIS-4, 1986, pp. 1061–1067.Google Scholar
[23] Linnros, J., Elliman, R.G. and Brown, W.L., in Beam-Solid Interactions and Transient Processes, edited by Picraux, S.T., Thompson, M.O. and Williams, J.S.(Materials Research Society, Pittsburgh, PA, 1987), Vol.74, pp 477480.Google Scholar