Hostname: page-component-586b7cd67f-dsjbd Total loading time: 0 Render date: 2024-11-28T15:04:36.155Z Has data issue: false hasContentIssue false

Time-Dependent Bias Stress-Induced Instability of SiC MOS Devices

Published online by Cambridge University Press:  01 February 2011

Aivars Lelis
Affiliation:
[email protected], U.S. Army Research Laboratory, SE-DP, 2800 Powder Mill Rd, Adelphi, MD, 20783, United States
Daniel Habersat
Affiliation:
[email protected], U.S. Army Research Laboratory, Adelphi, MD, 20783, United States
Fatimat Olaniran
Affiliation:
[email protected], U.S. Army Research Laboratory, Adelphi, MD, 20783, United States
Brian Simons
Affiliation:
[email protected], U.S. Army Research Laboratory, Adelphi, MD, 20783, United States
James McGarrity
Affiliation:
[email protected], Berkeley Research Associates, Springfield, VA, 22150, United States
F. Barry McLean
Affiliation:
[email protected], Berkeley Research Associates, Springfield, VA, 22150, United States
Neil Goldsman
Affiliation:
[email protected], University of Maryland, Electrical and Computer Engineering, College Park, MD, 20742, United States
Get access

Abstract

We have observed a gate-bias stress induced instability in both the threshold voltage of SiC MOSFETs and the flatband voltage of SiC MOS capacitors. The magnitude of this bias stress-induced instability generally increases linearly with log time, with no saturation of the effect observed, even out to 100,000 seconds. The magnitude also increases with increasing gate field. A positive gate-bias stress causes a positive shift and a negative gate-bias stress causes a negative shift, consistent with electron tunneling into or out of oxide traps near the SiC / SiO2 interface as opposed to mobile ions drifting across the gate oxide. The effect is repeatable.

Type
Research Article
Copyright
Copyright © Materials Research Society 2006

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1 Powell, S.K., Goldsman, N., McGarrity, J.M., and Bernstein, J., J. Appl. Phys. 92 (2002), p 4053.Google Scholar
2 Lelis, A.J., Habersat, D., Lopez, G., McGarrity, J., McLean, F.B., and Goldsman, N., Materials Science Forum (Proceedings of the 2005 ICSCRM), to be published.Google Scholar
3 Deal, B.E., IEEE Trans. Elec. Dev., ED–27 (1980), p. 606.Google Scholar
4 Dhar, S., Pantelides, S.T., Feldman, L.C., Isaacs-Smith, T., Wang, S., and Williams, J.R., Materials Science Forum (Proceedings of the 2005 ICSCRM), to be published.Google Scholar
5 Habersat, D., Lelis, A.J., Lopez, G., McGarrity, J., and McLean, F.B., Materials Science Forum (Proceedings of the 2005 ICSCRM), to be published.Google Scholar
6 Chang, K.C., Nuhfer, N.T., Porter, L.M., and Wahab, Q., Appl. Phys. Lett., 77:14 (2000), p 2186.Google Scholar
7 Jernigan, G.G., Stahlbush, R.E., Das, M.K., Cooper, J.A. Jr., and Lipkin, L.A., Appl. Phys. Lett., 74:10 (1999), p 1448.Google Scholar