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Thin Film Decoupling Circuits, Making Use of a Three-dimensional Integration of Thin Film Passive Components

Published online by Cambridge University Press:  10 February 2011

M. Klee ,
P. Löbl ,
R. Kiewitt ,
W. Brand ,
P. van Oppen  and
P. Lok
M. Klee
Affiliation:
Philips GmbH Forschungslaboratorien Aachen, Weiβhausstr. 2, 52066 Aachen, Germany, [email protected]
P. Löbl
Affiliation:
Philips GmbH Forschungslaboratorien Aachen, Weiβhausstr. 2, 52066 Aachen, Germany, [email protected]
R. Kiewitt
Affiliation:
Philips GmbH Forschungslaboratorien Aachen, Weiβhausstr. 2, 52066 Aachen, Germany, [email protected]
W. Brand
Affiliation:
Philips GmbH Forschungslaboratorien Aachen, Weiβhausstr. 2, 52066 Aachen, Germany, [email protected]
P. van Oppen
Affiliation:
Philips Advanced Ceramics and Modules, Roermond
P. Lok
Affiliation:
Philips Discrete Semiconductors, Nijmegen
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Abstract

In electronic circuits besides active devices a major part of the components are discrete passive components such as capacitors, resistors and inductors. Especially in the telecommunication circuits, miniaturisation is a major issue. To achieve a high degree of miniaturisation of passive components, thin film processes have been applied. A thin film module for high frequency applications has been demonstrated with a three-dimensional integration of a thin film resistor, a thin film X7R capacitor and a thin film NP0 capacitor processed on top of each other.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 596: Symposium Y – Ferroelectric Thin Films VIII , 1999 , 463
Copyright
Copyright © Materials Research Society 2000

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